Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging

Pak, Seong Woo; Tatsumi, Hiroaki; Wang, Jianhao; Wu, Albert T.; Nishikawa, Hiroshi

doi:https://doi.org/10.1016/j.intermet.2025.108686

Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging

Pak, Seong Woo; Tatsumi, Hiroaki; Wang, Jianhao et al.

Intermetallics, 2025, 179, 108686

アクセス数:572件（2025-08-15 05:44 集計）

固定URL: https://hdl.handle.net/11094/100979

閲覧可能ファイル

ファイル	フォーマット	利用条件	サイズ	閲覧回数	利用開始日	説明	information
Intermet_179	pdf	なし	8.26 MB	29	2025.04.15

Creative Commons : 表示

論文情報

ファイル出力 EndNote Basic出力 Mendeley出力

タイトル	Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
著者	著者名 Pak, Seong Woo
	NRID 1000000961757 1000000961757 ORCID 0000-0002-0561-3100 0000-0002-0561-3100 researchmap permalink hiroaki_tatsumi hiroaki_tatsumi Scopus Author ID 54914528200 54914528200 著者名 Tatsumi, Hiroaki
	著者名 Wang, Jianhao
	著者名 Wu, Albert T.
	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 著者名 Nishikawa, Hiroshi
キーワード等	Ag sintering
	IMC growth kinetics
	Intermetallic compound
	Microstructural evolution
	Thermoelectric
内容	Pak S.W., Tatsumi H., Wang J., et al. Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging. Intermetallics 179, 108686 (2025); https://doi.org/10.1016/j.intermet.2025.108686.
抄録	Bonding materials that can withstand high operating temperatures are essential for increasing the conversion efficiencies of thermoelectric power-generation devices. Sn-based solders commonly used to join thermoelectric materials and electrodes have the disadvantage of limiting the maximum operating temperature to 150 °C because of their low melting point. To overcome this limitation, in the present study, Ag nanoparticle paste with high-temperature stability, low electrical resistivity, high thermal conductivity, and printability was used for bonding a Bi2Te3 thermoelectric material and an electroless nickel immersion gold (ENIG)-plated Cu electrode. We performed isothermal aging at 200 °C from 0 to 1000 h to analyze the microstructural and thickness changes in intermetallic compounds (IMCs). Initially, a heterogeneous distribution of the IMC layers was observed at the bonding interface; over time, the IMC structures became clearly distinct. The IMC thickness increased from ≤3.0 μm (initial) to 45.6 μm in 1000 h, growing by a factor of approximately 15.2. We analyzed the growth kinetics of AgTe and BiTe IMCs. The growth exponent n of the AgTe IMC was found to be 0.3, indicating grain boundary diffusion with grain-growth control, whereas the n value of the BiTe IMC was 0.5, which is consistent with volumetric diffusion-controlled growth. These differences in the growth behavior indicate that different diffusion mechanisms affect the reliability and performance of the bonding interface.
出版者	Elsevier Ltd
収録物名	Intermetallics
巻(号)	179
ページ	108686
刊行年月	2025-04-01
言語	英語
ハンドルURL	https://hdl.handle.net/11094/100979
PISSN	09669795
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1016/j.intermet.2025.108686
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCTERMS.bibliographicCitation	Intermetallics. 2025, 179, p. 108686
DC.title	Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
DC.creator	Pak, Seong Woo
	Tatsumi, Hiroaki
	Wang, Jianhao
	Wu, Albert T.
	Nishikawa, Hiroshi
DC.publisher	Elsevier Ltd
DC.language' scheme='DCTERMS.RFC1766	英語
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2025-04-01
DC.identifier	https://doi.org/10.1016/j.intermet.2025.108686
DC.subject	Ag sintering
	IMC growth kinetics
	Intermetallic compound
	Microstructural evolution
	Thermoelectric
DC.description	Pak S.W., Tatsumi H., Wang J., et al. Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging. Intermetallics 179, 108686 (2025); https://doi.org/10.1016/j.intermet.2025.108686.
DCTERMS.abstract	Bonding materials that can withstand high operating temperatures are essential for increasing the conversion efficiencies of thermoelectric power-generation devices. Sn-based solders commonly used to join thermoelectric materials and electrodes have the disadvantage of limiting the maximum operating temperature to 150 °C because of their low melting point. To overcome this limitation, in the present study, Ag nanoparticle paste with high-temperature stability, low electrical resistivity, high thermal conductivity, and printability was used for bonding a Bi2Te3 thermoelectric material and an electroless nickel immersion gold (ENIG)-plated Cu electrode. We performed isothermal aging at 200 °C from 0 to 1000 h to analyze the microstructural and thickness changes in intermetallic compounds (IMCs). Initially, a heterogeneous distribution of the IMC layers was observed at the bonding interface; over time, the IMC structures became clearly distinct. The IMC thickness increased from ≤3.0 μm (initial) to 45.6 μm in 1000 h, growing by a factor of approximately 15.2. We analyzed the growth kinetics of AgTe and BiTe IMCs. The growth exponent n of the AgTe IMC was found to be 0.3, indicating grain boundary diffusion with grain-growth control, whereas the n value of the BiTe IMC was 0.5, which is consistent with volumetric diffusion-controlled growth. These differences in the growth behavior indicate that different diffusion mechanisms affect the reliability and performance of the bonding interface.
DC.rights	This article is licensed under a Creative Commons Attribution 4.0 International License.
DC.format	100979
citation_title	Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
citation_author	Pak, Seong Woo
	Tatsumi, Hiroaki
	Wang, Jianhao
	Wu, Albert T.
	Nishikawa, Hiroshi
citation_publisher	Elsevier Ltd
citation_language	英語
citation_date	2025-04-01
citation_journal_title	Intermetallics
citation_volume	179
citation_firstpage	108686
citation_doi	https://doi.org/10.1016/j.intermet.2025.108686
citation_public_url	https://hdl.handle.net/11094/100979

Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging

閲覧可能ファイル

論文情報

論文詳細を表示