Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability

Chen, Chuantong; Liu, Li; Huo, Fupeng; Kim, Dongjin; Lee, Sangmin; Li, Wanli; Suganuma, Katsuaki

doi:https://doi.org/10.1016/j.ceramint.2025.01.444

Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability

Chen, Chuantong; Liu, Li; Huo, Fupeng et al.

Ceramics International, 2025, 51(12), 16061-16072

アクセス数:320件（2025-07-27 20:33 集計）

固定URL: https://hdl.handle.net/11094/101353

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タイトル	Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability
著者	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 著者名 Chen, Chuantong
	著者名 Liu, Li
	著者名 Huo, Fupeng
	著者名 Kim, Dongjin
	著者名 Lee, Sangmin
	著者名 Li, Wanli
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma 著者名 Suganuma, Katsuaki
キーワード等	Metal/ceramic direct bonding
	Molecular dynamics simulation
	Ag sinter paste
	Microstructure evolution
	High-temperature storage
	Interface bonding
内容	Chen C., Liu L., Huo F., et al. Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability. Ceramics International 51, 16061 (2025); https://doi.org/10.1016/j.ceramint.2025.01.444.
抄録	This study introduces a novel technology for direct bonding of bare aluminum (Al) to aluminum nitride (AlN) ceramics using Ag sinter paste under low-temperature conditions starting from 180 °C, and air environments. A robust interface shear strength of up to 40.5 MPa was achieved at a low sintering temperature of 300 °C under a pressure of 5 MPa, significantly lower than the melting point of Al (660 °C). Transmission Electron Microscopy (TEM) observations revealed that Ag particles attach to and inter-diffuse into the natural oxide layer of Al (Al2O3) and the AlN layers during the initial stages of sintering, forming a porous structure after sintering. Additionally, the interface bonding mechanism for Ag/Al and Ag/Al2O3 was analyzed using Molecular Dynamics (MD) simulations. The results indicated that the diffusion of Ag into Al2O3 occurs moderately faster than into Al, suggesting that the Al2O3 layer facilitates interface bonding for Ag during low-temperature, low-pressure sintering. The high-temperature reliability of the Al/AlN bonding structure was also examined by aging it at 300 °C for 500 h. Despite the microstructural evolution within the bonding layer, the shear strength remained above 20 MPa after aging, demonstrating excellent high-temperature stability.
出版者	Elsevier Ltd
収録物名	Ceramics International
巻(号)	51(12)
ページ	16061-16072
刊行年月	2025-04-24
言語	英語
ハンドルURL	https://hdl.handle.net/11094/101353
PISSN	02728842
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1016/j.ceramint.2025.01.444
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Ceramics International. 2025, 51(12), p. 16061-16072
DC.title	Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability
DC.creator	Chen, Chuantong
	Liu, Li
	Huo, Fupeng
	Kim, Dongjin
	Lee, Sangmin
	Li, Wanli
	Suganuma, Katsuaki
DC.publisher	Elsevier Ltd
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2025-04-24
DC.identifier	https://doi.org/10.1016/j.ceramint.2025.01.444
DC.subject	Metal/ceramic direct bonding
	Molecular dynamics simulation
	Ag sinter paste
	Microstructure evolution
	High-temperature storage
	Interface bonding
DC.description	Chen C., Liu L., Huo F., et al. Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability. Ceramics International 51, 16061 (2025); https://doi.org/10.1016/j.ceramint.2025.01.444.
DCTERMS.abstract	This study introduces a novel technology for direct bonding of bare aluminum (Al) to aluminum nitride (AlN) ceramics using Ag sinter paste under low-temperature conditions starting from 180 °C, and air environments. A robust interface shear strength of up to 40.5 MPa was achieved at a low sintering temperature of 300 °C under a pressure of 5 MPa, significantly lower than the melting point of Al (660 °C). Transmission Electron Microscopy (TEM) observations revealed that Ag particles attach to and inter-diffuse into the natural oxide layer of Al (Al2O3) and the AlN layers during the initial stages of sintering, forming a porous structure after sintering. Additionally, the interface bonding mechanism for Ag/Al and Ag/Al2O3 was analyzed using Molecular Dynamics (MD) simulations. The results indicated that the diffusion of Ag into Al2O3 occurs moderately faster than into Al, suggesting that the Al2O3 layer facilitates interface bonding for Ag during low-temperature, low-pressure sintering. The high-temperature reliability of the Al/AlN bonding structure was also examined by aging it at 300 °C for 500 h. Despite the microstructural evolution within the bonding layer, the shear strength remained above 20 MPa after aging, demonstrating excellent high-temperature stability.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.format	101353
citation_title	Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability
citation_author	Chen, Chuantong
	Liu, Li
	Huo, Fupeng
	Kim, Dongjin
	Lee, Sangmin
	Li, Wanli
	Suganuma, Katsuaki
citation_publisher	Elsevier Ltd
citation_language	英語
citation_date	2025-04-24
citation_journal_title	Ceramics International
citation_volume	51
citation_issue	12
citation_firstpage	16061
citation_lastpage	16072
citation_doi	https://doi.org/10.1016/j.ceramint.2025.01.444
citation_public_url	https://hdl.handle.net/11094/101353

Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability

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