学術雑誌論文

学術雑誌論文

text

CIRP Annals. 2025, 74(1), p. 435-439

Kinetic analysis of workpiece rotation behavior during double-sided polishing

Elsevier Inc.

英語

text

2025-07-12

https://doi.org/10.1016/j.cirp.2025.03.009

Satake U., Seguchi Y., Enomoto T.. Kinetic analysis of workpiece rotation behavior during double-sided polishing. CIRP Annals 74, 435 (2025); https://doi.org/10.1016/j.cirp.2025.03.009.

Unique clamping mechanism adopted in double-sided polishing (DSP) enables free rotation of workpieces, which is critical for achieving uniform material removal. However, the DSP process has long faced the issue of non-rotating workpieces, resulting in tapered shapes—an issue particularly relevant to silicon wafer polishing. In this study, a kinetic analysis is conducted to investigate workpiece rotation during DSP and to clarify the mechanism underlying tapering. This analysis identifies key variables governing rotational speed and primary factors contributing to workpiece nonrotation. These findings are validated experimentally, and a practical approach to preventing tapering is proposed.

This article is licensed under a Creative Commons Attribution 4.0 International License.

102603

Kinetic analysis of workpiece rotation behavior during double-sided polishing

Elsevier Inc.

英語

2025-07-12

CIRP Annals

74

1

435

439

https://doi.org/10.1016/j.cirp.2025.03.009

https://hdl.handle.net/11094/102603