Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging

Chen, Chuantong; Zhang, Luobin; Huo, Fupeng; Ueshima, Minoru; Su, Yutai; Long, Xu; Nakayama, Koji S.; Nishijima, Masahiko; Miyake, Hiroaki; Li, Mingyu; Suganuma, Katsuaki

doi:https://doi.org/10.1016/j.jmst.2025.07.042

Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging

Chen, Chuantong; Zhang, Luobin; Huo, Fupeng et al.

Journal of Materials Science and Technology, 2026, 253, 246-257

アクセス数:354件（2026-02-15 23:28 集計）

固定URL: https://hdl.handle.net/11094/102869

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タイトル	Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging
著者	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 著者名 Chen, Chuantong
	著者名 Zhang, Luobin
	著者名 Huo, Fupeng
	著者名 Ueshima, Minoru
	著者名 Su, Yutai
	著者名 Long, Xu
	NRID 1000050312640 1000050312640 ORCID 0000-0002-9165-3810 0000-0002-9165-3810 researchmap permalink kojisnakayama kojisnakayama Scopus Author ID 35422620300 35422620300 著者名 Nakayama, Koji S.
	ORCID 0000-0002-5143-7558 0000-0002-5143-7558 researchmap permalink 7000005445 7000005445 Scopus Author ID 13608349900 13608349900 著者名 Nishijima, Masahiko
	NRID 1000060421864 1000060421864 著者名 Miyake, Hiroaki
	著者名 Li, Mingyu
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma 著者名 Suganuma, Katsuaki
キーワード等	Ag porous sheet
	High dislocation density
	Large area bonding
	Rapid bonding
	SiC power modules
	Solid-state bonding
内容	Chen C., Zhang L., Huo F., et al. Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging. Journal of Materials Science and Technology 253, 246 (2026); https://doi.org/10.1016/j.jmst.2025.07.042.
抄録	This study introduces a novel rapid die attach and large-area substrate bonding technology based on an Ag porous sheet with ultra-fine grain structure and surface-driven stress. The Ag porous sheet is fabricated using Ag particles with a high dislocation density, processed via a hot-pressing method without the addition of any organic solvents. The high dislocation density of the Ag particles promotes neck growth during the fabrication of the Ag porous sheet. Additionally, surface polishing alters the grain structure to ultra-fine grains, which generates surface-driven stress. A shear strength of 82.1 MPa was achieved for the SiC dummy chip/Cu substrate joint using this Ag porous sheet, with a bonding time of only 1 min at 250 °C. Furthermore, large-area (30 mm × 30 mm) Cu die-to-Cu substrate bonding was successfully achieved using the Ag porous sheet, with a short heating time of 3 min at 250 °C. The bonding interface exhibited a bonding ratio of over 85 % for the large-area bonding. The rapid bonding mechanism was discussed and analyzed based on the surface stress and grain structure of the Ag porous sheet, validated through electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM), and finite element analysis (FEA). The use of this Ag porous sheet offers a highly efficient process with significant potential for a wide range of SiC power device applications in high-temperature and high-power electronics.
出版者	Chinese Society of Metals
収録物名	Journal of Materials Science and Technology
巻(号)	253
ページ	246-257
刊行年月	2026-05-10
言語	英語
ハンドルURL	https://hdl.handle.net/11094/102869
PISSN	10050302
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1016/j.jmst.2025.07.042
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Journal of Materials Science and Technology. 2026, 253, p. 246-257
DC.title	Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging
DC.creator	Chen, Chuantong
	Zhang, Luobin
	Huo, Fupeng
	Ueshima, Minoru
	Su, Yutai
	Long, Xu
	Nakayama, Koji S.
	Nishijima, Masahiko
	Miyake, Hiroaki
	Li, Mingyu
	Suganuma, Katsuaki
DC.publisher	Chinese Society of Metals
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2026-05-10
DC.identifier	https://doi.org/10.1016/j.jmst.2025.07.042
DC.subject	Ag porous sheet
	High dislocation density
	Large area bonding
	Rapid bonding
	SiC power modules
	Solid-state bonding
DC.description	Chen C., Zhang L., Huo F., et al. Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging. Journal of Materials Science and Technology 253, 246 (2026); https://doi.org/10.1016/j.jmst.2025.07.042.
DCTERMS.abstract	This study introduces a novel rapid die attach and large-area substrate bonding technology based on an Ag porous sheet with ultra-fine grain structure and surface-driven stress. The Ag porous sheet is fabricated using Ag particles with a high dislocation density, processed via a hot-pressing method without the addition of any organic solvents. The high dislocation density of the Ag particles promotes neck growth during the fabrication of the Ag porous sheet. Additionally, surface polishing alters the grain structure to ultra-fine grains, which generates surface-driven stress. A shear strength of 82.1 MPa was achieved for the SiC dummy chip/Cu substrate joint using this Ag porous sheet, with a bonding time of only 1 min at 250 °C. Furthermore, large-area (30 mm × 30 mm) Cu die-to-Cu substrate bonding was successfully achieved using the Ag porous sheet, with a short heating time of 3 min at 250 °C. The bonding interface exhibited a bonding ratio of over 85 % for the large-area bonding. The rapid bonding mechanism was discussed and analyzed based on the surface stress and grain structure of the Ag porous sheet, validated through electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM), and finite element analysis (FEA). The use of this Ag porous sheet offers a highly efficient process with significant potential for a wide range of SiC power device applications in high-temperature and high-power electronics.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.format	102869
citation_title	Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging
citation_author	Chen, Chuantong
	Zhang, Luobin
	Huo, Fupeng
	Ueshima, Minoru
	Su, Yutai
	Long, Xu
	Nakayama, Koji S.
	Nishijima, Masahiko
	Miyake, Hiroaki
	Li, Mingyu
	Suganuma, Katsuaki
citation_publisher	Chinese Society of Metals
citation_language	英語
citation_date	2026-05-10
citation_journal_title	Journal of Materials Science and Technology
citation_volume	253
citation_firstpage	246
citation_lastpage	257
citation_doi	https://doi.org/10.1016/j.jmst.2025.07.042
citation_public_url	https://hdl.handle.net/11094/102869

Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging

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