Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

Yamaoka, Kenji; Wada, Takuma; Ogasa, Iori; Komyo, Takeru; Luo, Chao; Ikura, Ryohei; Hino, Masahiro; Yamada, Masako; Seto, Hideki; Fujii, Yoshihisa; Uetsuji, Yasutomo; Takashima, Yoshinori

doi:https://doi.org/10.1002/adma.202507939

Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

Yamaoka, Kenji; Wada, Takuma; Ogasa, Iori et al.

Advanced Materials, 2025

アクセス数:22件（2025-11-28 05:39 集計）

固定URL: https://hdl.handle.net/11094/102960

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タイトル	Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion
著者	NRID 1000020985254 1000020985254 ORCID 0000-0001-5655-1643 0000-0001-5655-1643 researchmap permalink yamaokak23 yamaokak23 Scopus Author ID 58687129700 58687129700 著者名 Yamaoka, Kenji
	著者名 Wada, Takuma
	著者名 Ogasa, Iori
	著者名 Komyo, Takeru
	著者名 Luo, Chao
	著者名 Ikura, Ryohei
	NRID 1000070314292 1000070314292 著者名 Hino, Masahiro
	NRID 1000070708552 1000070708552 著者名 Yamada, Masako
	NRID 1000060216546 1000060216546 著者名 Seto, Hideki
	NRID 1000070578062 1000070578062 著者名 Fujii, Yoshihisa
	NRID 1000000340604 1000000340604 著者名 Uetsuji, Yasutomo
	NRID 1000040379277 1000040379277 ORCID 0000-0002-2620-3266 0000-0002-2620-3266 researchmap permalink ytakashima_0068747 ytakashima_0068747 Scopus Author ID 7103176267 7103176267 著者名 Takashima, Yoshinori
内容	Yamaoka Kenji, Wada Takuma, Ogasa Iori, et al. Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion. Advanced Materials (2025); https://doi.org/10.1002/adma.202507939.
抄録	Controllable adhesion that enables both reuse and dismantling is a key requirement for sustainable materials and device integration. Here,a polymeric adhesion system is demonstrated based on reversible interactions at the interface, in which the association and dissociation of supramolecular complexes are externally regulated by thermal and chemical stimuli. By tuning the glass transition temperature (Tg) of the polymers, chain mobility and complex reformation are simultaneously optimized, leading to enhanced interdiffusion and bond recombination at the adhesion interface. Neutron reflectivity (NR) measurements with deuterium labeling revealed that the interfacial width increased with annealing temperature, reaching up to 24.4 nm at 200 °C after 24 hours. The presence of reversible bonds suppressed polymer interdiffusion despite promoting adhesion strength. The resulting materials exhibit excellent reusability and dismantlability under mild stimuli, with strong potential for applications in recyclable electronics, automotive manufacturing, and temporary assembly technologies.
出版者	Wiley
収録物名	Advanced Materials
刊行年月	2025-10-03
言語	英語
ハンドルURL	https://hdl.handle.net/11094/102960
PISSN	09359648
eISSN	15214095
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1002/adma.202507939
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Advanced Materials. 2025
DC.title	Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion
DC.creator	Yamaoka, Kenji
	Wada, Takuma
	Ogasa, Iori
	Komyo, Takeru
	Luo, Chao
	Ikura, Ryohei
	Hino, Masahiro
	Yamada, Masako
	Seto, Hideki
	Fujii, Yoshihisa
	Uetsuji, Yasutomo
	Takashima, Yoshinori
DC.publisher	Wiley
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2025-10-03
DC.identifier	https://doi.org/10.1002/adma.202507939
DC.description	Yamaoka Kenji, Wada Takuma, Ogasa Iori, et al. Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion. Advanced Materials (2025); https://doi.org/10.1002/adma.202507939.
DCTERMS.abstract	Controllable adhesion that enables both reuse and dismantling is a key requirement for sustainable materials and device integration. Here,a polymeric adhesion system is demonstrated based on reversible interactions at the interface, in which the association and dissociation of supramolecular complexes are externally regulated by thermal and chemical stimuli. By tuning the glass transition temperature (Tg) of the polymers, chain mobility and complex reformation are simultaneously optimized, leading to enhanced interdiffusion and bond recombination at the adhesion interface. Neutron reflectivity (NR) measurements with deuterium labeling revealed that the interfacial width increased with annealing temperature, reaching up to 24.4 nm at 200 °C after 24 hours. The presence of reversible bonds suppressed polymer interdiffusion despite promoting adhesion strength. The resulting materials exhibit excellent reusability and dismantlability under mild stimuli, with strong potential for applications in recyclable electronics, automotive manufacturing, and temporary assembly technologies.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.format	102960
citation_title	Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion
citation_author	Yamaoka, Kenji
	Wada, Takuma
	Ogasa, Iori
	Komyo, Takeru
	Luo, Chao
	Ikura, Ryohei
	Hino, Masahiro
	Yamada, Masako
	Seto, Hideki
	Fujii, Yoshihisa
	Uetsuji, Yasutomo
	Takashima, Yoshinori
citation_publisher	Wiley
citation_language	英語
citation_date	2025-10-03
citation_journal_title	Advanced Materials
citation_doi	https://doi.org/10.1002/adma.202507939
citation_public_url	https://hdl.handle.net/11094/102960

Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

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