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jwri37_02_069
pdf
778 KB
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論文情報
タイトル
The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
著者
Ho, Li-Ngee Ho
Ho, Li-Ngee Ho
Nishikawa, Hiroshi
Nishikawa, Hiroshi
Natsume, Naohide
Natsume, Naohide
Takemoto, Tadashi
Takemoto, Tadashi
キーワード等
conductive adhesive
copper filler
trace element
oxidation resistance
抄録
The properties of electrically conductive adhesives filled with copper fillers containing trace elements such as Ag, Ge, Mg and Zn were investigated in terms of electrical conductivity and thermal stability. The metallic fillers were characterized by using particle size analysis and scanning electron microscopy. Oxidation of metallic fillers under high temperature exposure led to degradation of electrical conductivity in the conductive adhesives. The addition of Ag and Mg in the copper fillers had significant effects on the electrical conductivity and thermal stability in the electrically conductive adhesives.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
37
号
2
開始ページ
69
終了ページ
73
刊行年月
2008-12
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/10631
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.37 No.2 (2008-12)
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publisher
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.37(2) P.69-P.73
DC.title
The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
DC.creator
Ho, Li-Ngee Ho
Nishikawa, Hiroshi
Natsume, Naohide
Takemoto, Tadashi
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2008-12
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/10631
DC.subject
conductive adhesive
copper filler
trace element
oxidation resistance
DCTERMS.abstract
The properties of electrically conductive adhesives filled with copper fillers containing trace elements such as Ag, Ge, Mg and Zn were investigated in terms of electrical conductivity and thermal stability. The metallic fillers were characterized by using particle size analysis and scanning electron microscopy. Oxidation of metallic fillers under high temperature exposure led to degradation of electrical conductivity in the conductive adhesives. The addition of Ag and Mg in the copper fillers had significant effects on the electrical conductivity and thermal stability in the electrically conductive adhesives.
citation_title
The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
citation_author
Ho, Li-Ngee Ho
Nishikawa, Hiroshi
Natsume, Naohide
Takemoto, Tadashi
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2008-12
citation_journal_title
Transactions of JWRI
citation_volume
37
citation_issue
2
citation_firstpage
69
citation_lastpage
73
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/10631
citation_keywords
conductive adhesive
copper filler
trace element
oxidation resistance