The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives

Ho, Li-Ngee Ho; Nishikawa, Hiroshi; Natsume, Naohide; Takemoto, Tadashi

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タイトル	The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
著者	Ho, Li-Ngee Ho Ho, Li-Ngee Ho
	Nishikawa, Hiroshi Nishikawa, Hiroshi
	Natsume, Naohide Natsume, Naohide
	Takemoto, Tadashi Takemoto, Tadashi
キーワード等	conductive adhesive
	copper filler
	trace element
	oxidation resistance
抄録	The properties of electrically conductive adhesives filled with copper fillers containing trace elements such as Ag, Ge, Mg and Zn were investigated in terms of electrical conductivity and thermal stability. The metallic fillers were characterized by using particle size analysis and scanning electron microscopy. Oxidation of metallic fillers under high temperature exposure led to degradation of electrical conductivity in the conductive adhesives. The addition of Ag and Mg in the copper fillers had significant effects on the electrical conductivity and thermal stability in the electrically conductive adhesives.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	37
号	2
開始ページ	69
終了ページ	73
刊行年月	2008-12
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/10631
言語	英語
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.37 No.2 (2008-12)

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.37(2) P.69-P.73
DC.title	The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
DC.creator	Ho, Li-Ngee Ho
	Nishikawa, Hiroshi
	Natsume, Naohide
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2008-12
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/10631
DC.subject	conductive adhesive
	copper filler
	trace element
	oxidation resistance
DCTERMS.abstract	The properties of electrically conductive adhesives filled with copper fillers containing trace elements such as Ag, Ge, Mg and Zn were investigated in terms of electrical conductivity and thermal stability. The metallic fillers were characterized by using particle size analysis and scanning electron microscopy. Oxidation of metallic fillers under high temperature exposure led to degradation of electrical conductivity in the conductive adhesives. The addition of Ag and Mg in the copper fillers had significant effects on the electrical conductivity and thermal stability in the electrically conductive adhesives.
citation_title	The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
citation_author	Ho, Li-Ngee Ho
	Nishikawa, Hiroshi
	Natsume, Naohide
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2008-12
citation_journal_title	Transactions of JWRI
citation_volume	37
citation_issue	2
citation_firstpage	69
citation_lastpage	73
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/10631
citation_keywords	conductive adhesive
	copper filler
	trace element
	oxidation resistance

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