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jwri34_02_057
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論文情報
タイトル
Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
著者
Gao, Feng
Gao, Feng
Nishikawa, Hiroshi
Nishikawa, Hiroshi
Takemoto, Tadashi
Takemoto, Tadashi
キーワード等
Lead-free solder
Intermetallic compounds
Morphology
Additive
抄録
The microstructures of intermetallic compounds at the interface and dispersed in the solder matrix were characterized in this paper. Two sorts of solders, Sn3.5Ag and Sn3.5Ag0.3Co were selected to examine the interfacial reaction with the Cu substrate. In the Sn3.5Ag0.3Co solder matrix, the ternary Sn-Cu-Co IMC was detected, which indicated that the additives exhibit high affinity with the Sn atoms. The IMC composition on the solder side is almost the same as the ones distributed within the solder matrix, which means that the formation of IMC at this side is related closely to the solder microstructure. On the other hand, much lower additive concentrations were observed on the Cu side (or Cu₃Sn phase after aging). The non-homogeneous characteristic of IMC was suggested owing to the non-uniform concentration distribution of additives, that is, the IMCs morphology at the interface seemed quite different. The faceted and elongated shape was observed at the solder side, while the nearly rounded shape seen at the Cu side.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
34
号
2
開始ページ
57
終了ページ
61
刊行年月
2005-12
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/12170
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.34 No.2 (2005-12)
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publisher
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.34(2) P.57-P.61
DC.title
Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
DC.creator
Gao, Feng
Nishikawa, Hiroshi
Takemoto, Tadashi
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2005-12
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/12170
DC.subject
Lead-free solder
Intermetallic compounds
Morphology
Additive
DCTERMS.abstract
The microstructures of intermetallic compounds at the interface and dispersed in the solder matrix were characterized in this paper. Two sorts of solders, Sn3.5Ag and Sn3.5Ag0.3Co were selected to examine the interfacial reaction with the Cu substrate. In the Sn3.5Ag0.3Co solder matrix, the ternary Sn-Cu-Co IMC was detected, which indicated that the additives exhibit high affinity with the Sn atoms. The IMC composition on the solder side is almost the same as the ones distributed within the solder matrix, which means that the formation of IMC at this side is related closely to the solder microstructure. On the other hand, much lower additive concentrations were observed on the Cu side (or Cu₃Sn phase after aging). The non-homogeneous characteristic of IMC was suggested owing to the non-uniform concentration distribution of additives, that is, the IMCs morphology at the interface seemed quite different. The faceted and elongated shape was observed at the solder side, while the nearly rounded shape seen at the Cu side.
citation_title
Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
citation_author
Gao, Feng
Nishikawa, Hiroshi
Takemoto, Tadashi
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2005-12
citation_journal_title
Transactions of JWRI
citation_volume
34
citation_issue
2
citation_firstpage
57
citation_lastpage
61
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/12170
citation_keywords
Lead-free solder
Intermetallic compounds
Morphology
Additive