Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering

Nishikawa, Hiroshi; Iwata, Noriya; Takemoto, Tadashi

このアイテムのアクセス数:100件（2022-09-28 16:17 集計）

このアイテムへのリンクには次のURLをご利用ください: https://hdl.handle.net/11094/23154

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ファイル	フォーマット	サイズ	閲覧回数	利用開始日	説明
jwri41_01-033	pdf	516 KB	62	2012.11.16

論文情報

タイトル	Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
著者	NRID 1000040208161 1000040208161 著者名 Nishikawa, Hiroshi
	著者名 Iwata, Noriya
	NRID 1000060093431 1000060093431 著者名 Takemoto, Tadashi
キーワード等	Lead-free solder
	Laser reflow soldering
	Impact strength
	Ni-P/Au plating
抄録	The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
出版者	大阪大学接合科学研究所
	Joining and Welding Research Institute, Osaka University
	オオサカダイガクセツゴウカガクケンキュウジョ
収録物名	Transactions of JWRI
巻	41
号	1
開始ページ	33
終了ページ	36
刊行年月	2012-06
言語	英語
ハンドルURL	https://hdl.handle.net/11094/23154
ISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.41(1) p.33-p.36
DC.title	Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
DC.creator	Nishikawa, Hiroshi
	Iwata, Noriya
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
	Joining and Welding Research Institute, Osaka University
	オオサカダイガクセツゴウカガクケンキュウジョ
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2012-06
DC.subject	Lead-free solder
	Laser reflow soldering
	Impact strength
	Ni-P/Au plating
DCTERMS.abstract	The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
DC.format	application/pdf
citation_title	Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
citation_author	Nishikawa, Hiroshi
	Iwata, Noriya
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
	Joining and Welding Research Institute, Osaka University
	オオサカダイガクセツゴウカガクケンキュウジョ
citation_language	英語
citation_date	2012-06
citation_journal_title	Transactions of JWRI
citation_volume	41
citation_issue	1
citation_firstpage	33
citation_lastpage	36
citation_issn	03874508
citation_public_url	https://hdl.handle.net/11094/23154

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