Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering

Nishikawa, Hiroshi; Iwata, Noriya; Takemoto, Tadashi

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タイトル	Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
著者	Nishikawa, Hiroshi Nishikawa, Hiroshi
	Iwata, Noriya Iwata, Noriya
	Takemoto, Tadashi Takemoto, Tadashi
キーワード等	Lead-free solder
	Laser reflow soldering
	Impact strength
	Ni-P/Au plating
抄録	The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	41
号	1
開始ページ	33
終了ページ	36
刊行年月	2012-06
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/23154
言語	英語
カテゴリ	紀要論文 Departmental Bulletin Paper

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.41(1) P.33-P.36
DC.title	Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
DC.creator	Nishikawa, Hiroshi
	Iwata, Noriya
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2012-06
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/23154
DC.subject	Lead-free solder
	Laser reflow soldering
	Impact strength
	Ni-P/Au plating
DCTERMS.abstract	The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
citation_title	Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
citation_author	Nishikawa, Hiroshi
	Iwata, Noriya
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2012-06
citation_journal_title	Transactions of JWRI
citation_volume	41
citation_issue	1
citation_firstpage	33
citation_lastpage	36
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/23154
citation_keywords	Lead-free solder
	Laser reflow soldering
	Impact strength
	Ni-P/Au plating

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