Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering

Nishikawa, Hiroshi; Iwata, Noriya; Takemoto, Tadashi

Transactions of JWRI, 2012, 41(1), 33-36

アクセス数:197件（2025-04-30 13:23 集計）

固定URL: https://hdl.handle.net/11094/23154

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論文情報

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タイトル
Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
著者
NRID
1000040208161 1000040208161
著者名
Nishikawa, Hiroshi
著者名
Iwata, Noriya
NRID
1000060093431 1000060093431
著者名
Takemoto, Tadashi
キーワード等
Lead-free solder
Laser reflow soldering
Impact strength
Ni-P/Au plating
抄録
The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
出版者
大阪大学接合科学研究所
Joining and Welding Research Institute, Osaka University
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
収録物名
Transactions of JWRI
巻(号)
41(1)
ページ
33-36
刊行年月
2012-06
言語
英語
ハンドルURL
https://hdl.handle.net/11094/23154
ISSN
03874508
NCID
AA00867058
アクセス権
open access
出版タイプ
Version of Record
カテゴリ
紀要論文 Departmental Bulletin Paper