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jwri41_01-033
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論文情報
タイトル
Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
著者
Nishikawa, Hiroshi
Nishikawa, Hiroshi
Iwata, Noriya
Iwata, Noriya
Takemoto, Tadashi
Takemoto, Tadashi
キーワード等
Lead-free solder
Laser reflow soldering
Impact strength
Ni-P/Au plating
抄録
The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
41
号
1
開始ページ
33
終了ページ
36
刊行年月
2012-06
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/23154
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
論文詳細を表示
著者版フラグ
publisher
NII資源タイプ
紀要論文
ローカル資源タイプ
紀要論文
dcmi資源タイプ
text
DCTERMS.bibliographicCitation
Transactions of JWRI.41(1) P.33-P.36
DC.title
Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
DC.creator
Nishikawa, Hiroshi
Iwata, Noriya
Takemoto, Tadashi
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2012-06
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/23154
DC.subject
Lead-free solder
Laser reflow soldering
Impact strength
Ni-P/Au plating
DCTERMS.abstract
The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.
citation_title
Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
citation_author
Nishikawa, Hiroshi
Iwata, Noriya
Takemoto, Tadashi
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2012-06
citation_journal_title
Transactions of JWRI
citation_volume
41
citation_issue
1
citation_firstpage
33
citation_lastpage
36
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/23154
citation_keywords
Lead-free solder
Laser reflow soldering
Impact strength
Ni-P/Au plating