Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder

Shimoda, Masayoshi; Yamakawa, Tomohiro; Shiokawa, Kunio; Nishikawa, Hiroshi; Takemoto, Tadashi

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タイトル	Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder
著者	Shimoda, Masayoshi Shimoda, Masayoshi
	Yamakawa, Tomohiro Yamakawa, Tomohiro
	Shiokawa, Kunio Shiokawa, Kunio
	Nishikawa, Hiroshi Nishikawa, Hiroshi
	Takemoto, Tadashi Takemoto, Tadashi
キーワード等	Bi-Ag alloys
	Tensile strength
	Elongation
	Solidification rate
	Primary Ag phase
抄録	As one of the candidate materials for the high-temperature-resistant joining materials which substitute from the conventional Pb-rich solder, Bi-Ag solder alloys were used to investigate the characteristics. The mechanical properties have been investigated on lead-free Bi-Ag alloys using tensile tests to clarify the important characteristics for solder alloys having reflow resistant relatively high melting temperature solders. The tensile strength gradually increased with increase of Ag content, however, the elongation showed a minimum at eutectic Bi-2.5Ag and it only slightly increased with increase of Ag content up to 11%Ag for quenched alloys. On the other hand, air cooled Bi-11Ag alloy showed improved elongation about 20%, the value is much higher than that of quenched one, about 3%. The hypereutectic Bi-11Ag solder can be used as a solder material having relatively good wettability and mechanical properties, in particular it showed elongation of 20% under air cooled condition.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	41
号	2
開始ページ	51
終了ページ	54
刊行年月	2012-12
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/24863
言語	英語

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.41(2) P.51-P.54
DC.title	Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder
DC.creator	Shimoda, Masayoshi
	Yamakawa, Tomohiro
	Shiokawa, Kunio
	Nishikawa, Hiroshi
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2012-12
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/24863
DC.subject	Bi-Ag alloys
	Tensile strength
	Elongation
	Solidification rate
	Primary Ag phase
DCTERMS.abstract	As one of the candidate materials for the high-temperature-resistant joining materials which substitute from the conventional Pb-rich solder, Bi-Ag solder alloys were used to investigate the characteristics. The mechanical properties have been investigated on lead-free Bi-Ag alloys using tensile tests to clarify the important characteristics for solder alloys having reflow resistant relatively high melting temperature solders. The tensile strength gradually increased with increase of Ag content, however, the elongation showed a minimum at eutectic Bi-2.5Ag and it only slightly increased with increase of Ag content up to 11%Ag for quenched alloys. On the other hand, air cooled Bi-11Ag alloy showed improved elongation about 20%, the value is much higher than that of quenched one, about 3%. The hypereutectic Bi-11Ag solder can be used as a solder material having relatively good wettability and mechanical properties, in particular it showed elongation of 20% under air cooled condition.
citation_title	Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder
citation_author	Shimoda, Masayoshi
	Yamakawa, Tomohiro
	Shiokawa, Kunio
	Nishikawa, Hiroshi
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2012-12
citation_journal_title	Transactions of JWRI
citation_volume	41
citation_issue	2
citation_firstpage	51
citation_lastpage	54
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/24863
citation_keywords	Bi-Ag alloys
	Tensile strength
	Elongation
	Solidification rate
	Primary Ag phase

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