Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding

Maeda, Masakatsu; Takahashi, Yasuo

このアイテムのアクセス数:33件（2021-09-20 07:37 集計）

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タイトル	Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
著者	Maeda, Masakatsu Maeda, Masakatsu
著者	Takahashi, Yasuo Takahashi, Yasuo
キーワード等	High-speed process monitoring
	Deformation of wiring material
	Expansion of adhered area
	Ultrasonic wedge bonding
	Power electronic devices
抄録	Thick Al wires were welded with Al-Si, Si and SiO_2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	42
号	2
開始ページ	15
終了ページ	20
刊行年月	2013-12
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/27403
言語	英語
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.42 No.2 (2013-12)

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.42(2) P.15-P.20
DC.title	Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
DC.creator	Maeda, Masakatsu
DC.creator	Takahashi, Yasuo
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2013-12
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/27403
DC.subject	High-speed process monitoring
	Deformation of wiring material
	Expansion of adhered area
	Ultrasonic wedge bonding
	Power electronic devices
DCTERMS.abstract	Thick Al wires were welded with Al-Si, Si and SiO_2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.
citation_title	Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
citation_author	Maeda, Masakatsu
citation_author	Takahashi, Yasuo
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2013-12
citation_journal_title	Transactions of JWRI
citation_volume	42
citation_issue	2
citation_firstpage	15
citation_lastpage	20
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/27403
citation_keywords	High-speed process monitoring
	Deformation of wiring material
	Expansion of adhered area
	Ultrasonic wedge bonding
	Power electronic devices

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