Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding

Maeda, Masakatsu; Takahashi, Yasuo

Transactions of JWRI, 2013, 42(2), 15-20

アクセス数:263件（2025-07-12 19:18 集計）

固定URL: https://doi.org/10.18910/27403

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論文情報

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タイトル
Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
著者
NRID
1000000263327 1000000263327
著者名
Maeda, Masakatsu
NRID
1000080144434 1000080144434
著者名
Takahashi, Yasuo
キーワード等
High-speed process monitoring
Deformation of wiring material
Expansion of adhered area
Ultrasonic wedge bonding
Power electronic devices
抄録
Thick Al wires were welded with Al-Si, Si and SiO_2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.
出版者
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
収録物名
Transactions of JWRI
巻(号)
42(2)
ページ
15-20
刊行年月
2013-12
言語
英語
ハンドルURL
https://hdl.handle.net/11094/27403
DOI
https://doi.org/10.18910/27403
PISSN
03874508
NCID
AA00867058
アクセス権
open access
出版タイプ
Version of Record
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.42 No.2 (2013-12)