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2021-01-27
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このアイテムへのリンクには次のURLをご利用ください:http://hdl.handle.net/11094/27403
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jwri42_2-015
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論文情報
タイトル
Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
著者
Maeda, Masakatsu
Maeda, Masakatsu
Takahashi, Yasuo
Takahashi, Yasuo
キーワード等
High-speed process monitoring
Deformation of wiring material
Expansion of adhered area
Ultrasonic wedge bonding
Power electronic devices
抄録
Thick Al wires were welded with Al-Si, Si and SiO_2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
42
号
2
開始ページ
15
終了ページ
20
刊行年月
2013-12
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/27403
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.42 No.2 (2013-12)
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著者版フラグ
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.42(2) P.15-P.20
DC.title
Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
DC.creator
Maeda, Masakatsu
Takahashi, Yasuo
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2013-12
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/27403
DC.subject
High-speed process monitoring
Deformation of wiring material
Expansion of adhered area
Ultrasonic wedge bonding
Power electronic devices
DCTERMS.abstract
Thick Al wires were welded with Al-Si, Si and SiO_2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.
citation_title
Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
citation_author
Maeda, Masakatsu
Takahashi, Yasuo
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2013-12
citation_journal_title
Transactions of JWRI
citation_volume
42
citation_issue
2
citation_firstpage
15
citation_lastpage
20
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/27403
citation_keywords
High-speed process monitoring
Deformation of wiring material
Expansion of adhered area
Ultrasonic wedge bonding
Power electronic devices