High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys

Shimoda, Masayoshi; Hidaka, Noboru; Watanabe, Hirohiko; Yoshiba, Masayuki

このアイテムのアクセス数:42件（2019-09-20 16:23 集計）

このアイテムへのリンクには次のURLをご利用ください:http://hdl.handle.net/11094/3713

閲覧可能ファイル

ファイル	フォーマット	サイズ	閲覧回数	説明
jwri40_02_049	pdf	318 KB	54

論文情報

タイトル	High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
著者	Shimoda, Masayoshi Shimoda, Masayoshi
	Hidaka, Noboru Hidaka, Noboru
	Watanabe, Hirohiko Watanabe, Hirohiko
	Yoshiba, Masayuki Yoshiba, Masayuki
キーワード等	Lead-free solder alloys
	Creep
	Activation energy
	Dislocation
抄録	In order to acquire relevant creep characteristics such as stress exponent and activation energy, creep strain tests were conducted on Sn-3.5Ag and Sn-5Sb systems of solder alloys in the intermediate temperature regime from 353 K to 453 K corresponding to the homologous temperaturesη=0.715～0.917 andη=0.699～0.897 for the two alloys, respectively. It was found that an apparent creep-activation energy of both Sn-3.5Ag and Sn-5Sb solder alloys had a change point at η=0.82 under the higher stress of 9.8 MPa. At the lower stress of 4 MPa, the change point was found only for Sn-5Sb alloy. Moreover, under the lower stress level, the stress exponent of both solder alloys are approximately 1, while under the higher stress region (more than 9.8 MPa), the stress exponents of both solders are 7 or more. Determining factors of creep deformation are discussed in relation to the temperature and stress region. It was considered that the deformation of both solder alloys is dominated by the rate of the dislocation climb/dislocation glide in the higher temperature and stress region.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	40
号	2
開始ページ	49
終了ページ	54
刊行年月	2011-12
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/3713
言語	英語
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.40 No.2 (2011-12)

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.40(2) P.49-P.54
DC.title	High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
DC.creator	Shimoda, Masayoshi
	Hidaka, Noboru
	Watanabe, Hirohiko
	Yoshiba, Masayuki
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2011-12
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/3713
DC.subject	Lead-free solder alloys
	Creep
	Activation energy
	Dislocation
DCTERMS.abstract	In order to acquire relevant creep characteristics such as stress exponent and activation energy, creep strain tests were conducted on Sn-3.5Ag and Sn-5Sb systems of solder alloys in the intermediate temperature regime from 353 K to 453 K corresponding to the homologous temperaturesη=0.715～0.917 andη=0.699～0.897 for the two alloys, respectively. It was found that an apparent creep-activation energy of both Sn-3.5Ag and Sn-5Sb solder alloys had a change point at η=0.82 under the higher stress of 9.8 MPa. At the lower stress of 4 MPa, the change point was found only for Sn-5Sb alloy. Moreover, under the lower stress level, the stress exponent of both solder alloys are approximately 1, while under the higher stress region (more than 9.8 MPa), the stress exponents of both solders are 7 or more. Determining factors of creep deformation are discussed in relation to the temperature and stress region. It was considered that the deformation of both solder alloys is dominated by the rate of the dislocation climb/dislocation glide in the higher temperature and stress region.
citation_title	High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
citation_author	Shimoda, Masayoshi
	Hidaka, Noboru
	Watanabe, Hirohiko
	Yoshiba, Masayuki
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2011-12
citation_journal_title	Transactions of JWRI
citation_volume	40
citation_issue	2
citation_firstpage	49
citation_lastpage	54
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/3713
citation_keywords	Lead-free solder alloys
	Creep
	Activation energy
	Dislocation

閲覧可能ファイル

論文情報

論文詳細を表示