High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys

Shimoda, Masayoshi; Hidaka, Noboru; Watanabe, Hirohiko; Yoshiba, Masayuki

doi:https://doi.org/10.18910/3713

このアイテムのアクセス数:153件（2023-12-06 03:06 集計）

このアイテムへのリンクには次のURLをご利用ください: https://doi.org/10.18910/3713

このアイテムへのリンクには次のURLをご利用ください: https://hdl.handle.net/11094/3713

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タイトル	High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
著者	著者名 Shimoda, Masayoshi
	著者名 Hidaka, Noboru
	著者名 Watanabe, Hirohiko
	NRID 1000030094288 1000030094288 著者名 Yoshiba, Masayuki
キーワード等	Lead-free solder alloys
	Creep
	Activation energy
	Dislocation
抄録	In order to acquire relevant creep characteristics such as stress exponent and activation energy, creep strain tests were conducted on Sn-3.5Ag and Sn-5Sb systems of solder alloys in the intermediate temperature regime from 353 K to 453 K corresponding to the homologous temperaturesη=0.715～0.917 andη=0.699～0.897 for the two alloys, respectively. It was found that an apparent creep-activation energy of both Sn-3.5Ag and Sn-5Sb solder alloys had a change point at η=0.82 under the higher stress of 9.8 MPa. At the lower stress of 4 MPa, the change point was found only for Sn-5Sb alloy. Moreover, under the lower stress level, the stress exponent of both solder alloys are approximately 1, while under the higher stress region (more than 9.8 MPa), the stress exponents of both solders are 7 or more. Determining factors of creep deformation are discussed in relation to the temperature and stress region. It was considered that the deformation of both solder alloys is dominated by the rate of the dislocation climb/dislocation glide in the higher temperature and stress region.
出版者	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
収録物名	Transactions of JWRI
巻(号)	40(2)
ページ	49-54
刊行年月	2011-12
言語	英語
ハンドルURL	https://hdl.handle.net/11094/3713
DOI	https://doi.org/10.18910/3713
PISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.40 No.2 (2011-12)

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2011, 40(2), p. 49-54
DC.title	High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
DC.creator	Shimoda, Masayoshi
	Hidaka, Noboru
	Watanabe, Hirohiko
	Yoshiba, Masayuki
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2011-12
DC.subject	Lead-free solder alloys
	Creep
	Activation energy
	Dislocation
DCTERMS.abstract	In order to acquire relevant creep characteristics such as stress exponent and activation energy, creep strain tests were conducted on Sn-3.5Ag and Sn-5Sb systems of solder alloys in the intermediate temperature regime from 353 K to 453 K corresponding to the homologous temperaturesη=0.715～0.917 andη=0.699～0.897 for the two alloys, respectively. It was found that an apparent creep-activation energy of both Sn-3.5Ag and Sn-5Sb solder alloys had a change point at η=0.82 under the higher stress of 9.8 MPa. At the lower stress of 4 MPa, the change point was found only for Sn-5Sb alloy. Moreover, under the lower stress level, the stress exponent of both solder alloys are approximately 1, while under the higher stress region (more than 9.8 MPa), the stress exponents of both solders are 7 or more. Determining factors of creep deformation are discussed in relation to the temperature and stress region. It was considered that the deformation of both solder alloys is dominated by the rate of the dislocation climb/dislocation glide in the higher temperature and stress region.
DC.identifier	10.18910/3713
DC.format	application/pdf
citation_doi	https://doi.org/10.18910/3713
citation_title	High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
citation_author	Shimoda, Masayoshi
	Hidaka, Noboru
	Watanabe, Hirohiko
	Yoshiba, Masayuki
citation_publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
citation_language	英語
citation_date	2011-12
citation_journal_title	Transactions of JWRI
citation_volume	40
citation_issue	2
citation_firstpage	49
citation_lastpage	54
citation_public_url	https://hdl.handle.net/11094/3713
citation_doi_detail	10.18910/3713

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