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論文情報
タイトル
High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
著者
Shimoda, Masayoshi
Shimoda, Masayoshi
Hidaka, Noboru
Hidaka, Noboru
Watanabe, Hirohiko
Watanabe, Hirohiko
Yoshiba, Masayuki
Yoshiba, Masayuki
キーワード等
Lead-free solder alloys
Creep
Activation energy
Dislocation
抄録
In order to acquire relevant creep characteristics such as stress exponent and activation energy, creep strain tests were conducted on Sn-3.5Ag and Sn-5Sb systems of solder alloys in the intermediate temperature regime from 353 K to 453 K corresponding to the homologous temperaturesη=0.715~0.917 andη=0.699~0.897 for the two alloys, respectively. It was found that an apparent creep-activation energy of both Sn-3.5Ag and Sn-5Sb solder alloys had a change point at η=0.82 under the higher stress of 9.8 MPa. At the lower stress of 4 MPa, the change point was found only for Sn-5Sb alloy. Moreover, under the lower stress level, the stress exponent of both solder alloys are approximately 1, while under the higher stress region (more than 9.8 MPa), the stress exponents of both solders are 7 or more. Determining factors of creep deformation are discussed in relation to the temperature and stress region. It was considered that the deformation of both solder alloys is dominated by the rate of the dislocation climb/dislocation glide in the higher temperature and stress region.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
40
号
2
開始ページ
49
終了ページ
54
刊行年月
2011-12
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/3713
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.40 No.2 (2011-12)
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著者版フラグ
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.40(2) P.49-P.54
DC.title
High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
DC.creator
Shimoda, Masayoshi
Hidaka, Noboru
Watanabe, Hirohiko
Yoshiba, Masayuki
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2011-12
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/3713
DC.subject
Lead-free solder alloys
Creep
Activation energy
Dislocation
DCTERMS.abstract
In order to acquire relevant creep characteristics such as stress exponent and activation energy, creep strain tests were conducted on Sn-3.5Ag and Sn-5Sb systems of solder alloys in the intermediate temperature regime from 353 K to 453 K corresponding to the homologous temperaturesη=0.715~0.917 andη=0.699~0.897 for the two alloys, respectively. It was found that an apparent creep-activation energy of both Sn-3.5Ag and Sn-5Sb solder alloys had a change point at η=0.82 under the higher stress of 9.8 MPa. At the lower stress of 4 MPa, the change point was found only for Sn-5Sb alloy. Moreover, under the lower stress level, the stress exponent of both solder alloys are approximately 1, while under the higher stress region (more than 9.8 MPa), the stress exponents of both solders are 7 or more. Determining factors of creep deformation are discussed in relation to the temperature and stress region. It was considered that the deformation of both solder alloys is dominated by the rate of the dislocation climb/dislocation glide in the higher temperature and stress region.
citation_title
High Temperature Creep Properties of Sn-3.5Ag and Sn-5Sb Lead-free Solder Alloys
citation_author
Shimoda, Masayoshi
Hidaka, Noboru
Watanabe, Hirohiko
Yoshiba, Masayuki
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2011-12
citation_journal_title
Transactions of JWRI
citation_volume
40
citation_issue
2
citation_firstpage
49
citation_lastpage
54
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/3713
citation_keywords
Lead-free solder alloys
Creep
Activation energy
Dislocation