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このアイテムへのリンクには次のURLをご利用ください:http://hdl.handle.net/11094/4054
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jwri40_01_047
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論文情報
タイトル
Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
著者
Watanabe, Hirohiko
Watanabe, Hirohiko
Ishikawa, Sumihisa
Ishikawa, Sumihisa
Ito, Mototaka
Ito, Mototaka
Sako, Hideki
Sako, Hideki
Kimura, Kosuke
Kimura, Kosuke
Nakagawa, Yoshitsugu
Nakagawa, Yoshitsugu
Shimoda, Masayoshi
Shimoda, Masayoshi
キーワード等
Interface
Wire bonding
Interfacial reaction
Pt bonding pad
Au wire
抄録
The Au wire/Pt bonding pad interface mechanism using ultrasonic bonding was studied in this paper. Following experiments were investigated ; After the bonding process or thermal aging test at 235℃ for 300 h, the Au-Pt interface was observed by UHR-SEM, TEM and electron diffraction. Intermetallic compound layer was not formed. Even under thermal aging less than 235℃, Au-Pt interface keeps the same structure. These results show that Au-Pt bonding has strong thermal stability.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
40
号
1
開始ページ
47
終了ページ
51
刊行年月
2011-06
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/4054
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.40 No.1 (2011-06)
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著者版フラグ
publisher
NII資源タイプ
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紀要論文
dcmi資源タイプ
text
DCTERMS.bibliographicCitation
Transactions of JWRI.40(1) P.47-P.51
DC.title
Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
DC.creator
Watanabe, Hirohiko
Ishikawa, Sumihisa
Ito, Mototaka
Sako, Hideki
Kimura, Kosuke
Nakagawa, Yoshitsugu
Shimoda, Masayoshi
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2011-06
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/4054
DC.subject
Interface
Wire bonding
Interfacial reaction
Pt bonding pad
Au wire
DCTERMS.abstract
The Au wire/Pt bonding pad interface mechanism using ultrasonic bonding was studied in this paper. Following experiments were investigated ; After the bonding process or thermal aging test at 235℃ for 300 h, the Au-Pt interface was observed by UHR-SEM, TEM and electron diffraction. Intermetallic compound layer was not formed. Even under thermal aging less than 235℃, Au-Pt interface keeps the same structure. These results show that Au-Pt bonding has strong thermal stability.
citation_title
Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
citation_author
Watanabe, Hirohiko
Ishikawa, Sumihisa
Ito, Mototaka
Sako, Hideki
Kimura, Kosuke
Nakagawa, Yoshitsugu
Shimoda, Masayoshi
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2011-06
citation_journal_title
Transactions of JWRI
citation_volume
40
citation_issue
1
citation_firstpage
47
citation_lastpage
51
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/4054
citation_keywords
Interface
Wire bonding
Interfacial reaction
Pt bonding pad
Au wire