Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode

Watanabe, Hirohiko; Ishikawa, Sumihisa; Ito, Mototaka; Sako, Hideki; Kimura, Kosuke; Nakagawa, Yoshitsugu; Shimoda, Masayoshi

doi:https://doi.org/10.18910/4054

Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode

Watanabe, Hirohiko; Ishikawa, Sumihisa; Ito, Mototaka et al.

Transactions of JWRI, 2011, 40(1), 47-51

アクセス数:558件（2025-07-12 19:16 集計）

固定URL: https://doi.org/10.18910/4054

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タイトル	Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
著者	著者名 Watanabe, Hirohiko
	著者名 Ishikawa, Sumihisa
	著者名 Ito, Mototaka
	著者名 Sako, Hideki
	著者名 Kimura, Kosuke
	著者名 Nakagawa, Yoshitsugu
	著者名 Shimoda, Masayoshi
キーワード等	Interface
	Wire bonding
	Interfacial reaction
	Pt bonding pad
	Au wire
抄録	The Au wire/Pt bonding pad interface mechanism using ultrasonic bonding was studied in this paper. Following experiments were investigated ; After the bonding process or thermal aging test at 235℃ for 300 h, the Au-Pt interface was observed by UHR-SEM, TEM and electron diffraction. Intermetallic compound layer was not formed. Even under thermal aging less than 235℃, Au-Pt interface keeps the same structure. These results show that Au-Pt bonding has strong thermal stability.
出版者	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
収録物名	Transactions of JWRI
巻(号)	40(1)
ページ	47-51
刊行年月	2011-06
言語	英語
ハンドルURL	https://hdl.handle.net/11094/4054
DOI	https://doi.org/10.18910/4054
PISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.40 No.1 (2011-06)

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2011, 40(1), p. 47-51
DC.title	Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
DC.creator	Watanabe, Hirohiko
	Ishikawa, Sumihisa
	Ito, Mototaka
	Sako, Hideki
	Kimura, Kosuke
	Nakagawa, Yoshitsugu
	Shimoda, Masayoshi
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2011-06
DC.subject	Interface
	Wire bonding
	Interfacial reaction
	Pt bonding pad
	Au wire
DCTERMS.abstract	The Au wire/Pt bonding pad interface mechanism using ultrasonic bonding was studied in this paper. Following experiments were investigated ; After the bonding process or thermal aging test at 235℃ for 300 h, the Au-Pt interface was observed by UHR-SEM, TEM and electron diffraction. Intermetallic compound layer was not formed. Even under thermal aging less than 235℃, Au-Pt interface keeps the same structure. These results show that Au-Pt bonding has strong thermal stability.
DC.identifier	10.18910/4054
DC.format	4054
citation_title	Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
citation_author	Watanabe, Hirohiko
	Ishikawa, Sumihisa
	Ito, Mototaka
	Sako, Hideki
	Kimura, Kosuke
	Nakagawa, Yoshitsugu
	Shimoda, Masayoshi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2011-06
citation_journal_title	Transactions of JWRI
citation_volume	40
citation_issue	1
citation_firstpage	47
citation_lastpage	51
citation_public_url	https://hdl.handle.net/11094/4054
citation_doi_detail	10.18910/4054
citation_doi	https://doi.org/10.18910/4054

Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode

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