Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode

Watanabe, Hirohiko; Ishikawa, Sumihisa; Ito, Mototaka; Sako, Hideki; Kimura, Kosuke; Nakagawa, Yoshitsugu; Shimoda, Masayoshi

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タイトル	Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
著者	Watanabe, Hirohiko Watanabe, Hirohiko
	Ishikawa, Sumihisa Ishikawa, Sumihisa
	Ito, Mototaka Ito, Mototaka
	Sako, Hideki Sako, Hideki
	Kimura, Kosuke Kimura, Kosuke
	Nakagawa, Yoshitsugu Nakagawa, Yoshitsugu
	Shimoda, Masayoshi Shimoda, Masayoshi
キーワード等	Interface
	Wire bonding
	Interfacial reaction
	Pt bonding pad
	Au wire
抄録	The Au wire/Pt bonding pad interface mechanism using ultrasonic bonding was studied in this paper. Following experiments were investigated ; After the bonding process or thermal aging test at 235℃ for 300 h, the Au-Pt interface was observed by UHR-SEM, TEM and electron diffraction. Intermetallic compound layer was not formed. Even under thermal aging less than 235℃, Au-Pt interface keeps the same structure. These results show that Au-Pt bonding has strong thermal stability.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	40
号	1
開始ページ	47
終了ページ	51
刊行年月	2011-06
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/4054
言語	英語

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.40(1) P.47-P.51
DC.title	Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
DC.creator	Watanabe, Hirohiko
	Ishikawa, Sumihisa
	Ito, Mototaka
	Sako, Hideki
	Kimura, Kosuke
	Nakagawa, Yoshitsugu
	Shimoda, Masayoshi
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2011-06
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/4054
DC.subject	Interface
	Wire bonding
	Interfacial reaction
	Pt bonding pad
	Au wire
DCTERMS.abstract	The Au wire/Pt bonding pad interface mechanism using ultrasonic bonding was studied in this paper. Following experiments were investigated ; After the bonding process or thermal aging test at 235℃ for 300 h, the Au-Pt interface was observed by UHR-SEM, TEM and electron diffraction. Intermetallic compound layer was not formed. Even under thermal aging less than 235℃, Au-Pt interface keeps the same structure. These results show that Au-Pt bonding has strong thermal stability.
citation_title	Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode
citation_author	Watanabe, Hirohiko
	Ishikawa, Sumihisa
	Ito, Mototaka
	Sako, Hideki
	Kimura, Kosuke
	Nakagawa, Yoshitsugu
	Shimoda, Masayoshi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2011-06
citation_journal_title	Transactions of JWRI
citation_volume	40
citation_issue	1
citation_firstpage	47
citation_lastpage	51
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/4054
citation_keywords	Interface
	Wire bonding
	Interfacial reaction
	Pt bonding pad
	Au wire

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