Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint

Mokhtari, Omid; Nishikawa, Hiroshi

doi:https://doi.org/10.18910/51364

Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint

Mokhtari, Omid; Nishikawa, Hiroshi

Transactions of JWRI, 2014, 43(2), 21-25

アクセス数:573件（2025-09-30 08:11 集計）

固定URL: https://doi.org/10.18910/51364

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タイトル	Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint
著者	著者名 Mokhtari, Omid
著者	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 著者名 Nishikawa, Hiroshi
キーワード等	Pb-free solder
	Sn–Bi solder
	Bi coarsening
	microstructure refinement
抄録	In this study, the effect of adding 0.5 and 1 wt% In to Sn–58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during reflow; however, the addition of 0.5 wt% In was effective in suppressing the MC layer growth during thermal aging. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.
出版者	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
収録物名	Transactions of JWRI
巻(号)	43(2)
ページ	21-25
刊行年月	2014-12
言語	英語
ハンドルURL	https://hdl.handle.net/11094/51364
DOI	https://doi.org/10.18910/51364
PISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.43 No.2 (2014-12)

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2014, 43(2), p. 21-25
DC.title	Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint
DC.creator	Mokhtari, Omid
DC.creator	Nishikawa, Hiroshi
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2014-12
DC.subject	Pb-free solder
	Sn–Bi solder
	Bi coarsening
	microstructure refinement
DCTERMS.abstract	In this study, the effect of adding 0.5 and 1 wt% In to Sn–58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during reflow; however, the addition of 0.5 wt% In was effective in suppressing the MC layer growth during thermal aging. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.
DC.identifier	10.18910/51364
DC.format	51364
citation_title	Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint
citation_author	Mokhtari, Omid
citation_author	Nishikawa, Hiroshi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2014-12
citation_journal_title	Transactions of JWRI
citation_volume	43
citation_issue	2
citation_firstpage	21
citation_lastpage	25
citation_public_url	https://hdl.handle.net/11094/51364
citation_doi_detail	10.18910/51364
citation_doi	https://doi.org/10.18910/51364

Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint

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