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論文情報
タイトル
Environmentally Friendly Low Temperature Solid State Micro-joining
著者
Takahashi, Yasuo
Takahashi, Yasuo
Maeda, Masakatsu
Maeda, Masakatsu
キーワード等
Room temperature bonding
Micro-joining
Flip chip bonding
Chip scale packaging
Ultrasonic bonding
Solid state joining
Environmentally benign technology
Eco technology
Electronic assembly
抄録
The present review describes the low temperature solid state micro-joining applied to advanced electronics packaging. Four topics are introduced. The first one concerns the trend of semi-conductor packaging. The second one is the room temperature bonding carried out under an ultra high vacuum condition. The third one is the mechanism of micro bump bonding applied to the electronic assemblies. The bump bonding is usually called "flip chip bonding (FCP)" and is applied to the chip scale packaging (CSP), which is very important for three dimensional packaging. The bump deformation behavior is visualized by numerical simulation. The bond area growth mechanism (slip and folding mechanism) is numerically analyzed. The last one is the ultrasonic bonding between Au wire and Al pad. The Al pad has a very strong thin oxide film on the surface. The breakdown of the oxide film is discussed based on the idea of the slip and folding mechanism. The effect of ultrasonic vibration on the low temperature solid state micro-joining process is also discussed.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
40
号
1
開始ページ
1
終了ページ
7
刊行年月
2011-06
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/5785
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.40 No.1 (2011-06)
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著者版フラグ
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.40(1) P.1-P.7
DC.title
Environmentally Friendly Low Temperature Solid State Micro-joining
DC.creator
Takahashi, Yasuo
Maeda, Masakatsu
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2011-06
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/5785
DC.subject
Room temperature bonding
Micro-joining
Flip chip bonding
Chip scale packaging
Ultrasonic bonding
Solid state joining
Environmentally benign technology
Eco technology
Electronic assembly
DCTERMS.abstract
The present review describes the low temperature solid state micro-joining applied to advanced electronics packaging. Four topics are introduced. The first one concerns the trend of semi-conductor packaging. The second one is the room temperature bonding carried out under an ultra high vacuum condition. The third one is the mechanism of micro bump bonding applied to the electronic assemblies. The bump bonding is usually called "flip chip bonding (FCP)" and is applied to the chip scale packaging (CSP), which is very important for three dimensional packaging. The bump deformation behavior is visualized by numerical simulation. The bond area growth mechanism (slip and folding mechanism) is numerically analyzed. The last one is the ultrasonic bonding between Au wire and Al pad. The Al pad has a very strong thin oxide film on the surface. The breakdown of the oxide film is discussed based on the idea of the slip and folding mechanism. The effect of ultrasonic vibration on the low temperature solid state micro-joining process is also discussed.
citation_title
Environmentally Friendly Low Temperature Solid State Micro-joining
citation_author
Takahashi, Yasuo
Maeda, Masakatsu
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2011-06
citation_journal_title
Transactions of JWRI
citation_volume
40
citation_issue
1
citation_firstpage
1
citation_lastpage
7
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/5785
citation_keywords
Room temperature bonding
Micro-joining
Flip chip bonding
Chip scale packaging
Ultrasonic bonding
Solid state joining
Environmentally benign technology
Eco technology
Electronic assembly