Environmentally Friendly Low Temperature Solid State Micro-joining

Takahashi, Yasuo; Maeda, Masakatsu

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タイトル	Environmentally Friendly Low Temperature Solid State Micro-joining
著者	Takahashi, Yasuo Takahashi, Yasuo
著者	Maeda, Masakatsu Maeda, Masakatsu
キーワード等	Room temperature bonding
	Micro-joining
	Flip chip bonding
	Chip scale packaging
	Ultrasonic bonding
	Solid state joining
	Environmentally benign technology
	Eco technology
	Electronic assembly
抄録	The present review describes the low temperature solid state micro-joining applied to advanced electronics packaging. Four topics are introduced. The first one concerns the trend of semi-conductor packaging. The second one is the room temperature bonding carried out under an ultra high vacuum condition. The third one is the mechanism of micro bump bonding applied to the electronic assemblies. The bump bonding is usually called "flip chip bonding (FCP)" and is applied to the chip scale packaging (CSP), which is very important for three dimensional packaging. The bump deformation behavior is visualized by numerical simulation. The bond area growth mechanism (slip and folding mechanism) is numerically analyzed. The last one is the ultrasonic bonding between Au wire and Al pad. The Al pad has a very strong thin oxide film on the surface. The breakdown of the oxide film is discussed based on the idea of the slip and folding mechanism. The effect of ultrasonic vibration on the low temperature solid state micro-joining process is also discussed.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	40
号	1
開始ページ	1
終了ページ	7
刊行年月	2011-06
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/5785
言語	英語
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.40 No.1 (2011-06)

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.40(1) P.1-P.7
DC.title	Environmentally Friendly Low Temperature Solid State Micro-joining
DC.creator	Takahashi, Yasuo
DC.creator	Maeda, Masakatsu
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2011-06
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/5785
DC.subject	Room temperature bonding
	Micro-joining
	Flip chip bonding
	Chip scale packaging
	Ultrasonic bonding
	Solid state joining
	Environmentally benign technology
	Eco technology
	Electronic assembly
DCTERMS.abstract	The present review describes the low temperature solid state micro-joining applied to advanced electronics packaging. Four topics are introduced. The first one concerns the trend of semi-conductor packaging. The second one is the room temperature bonding carried out under an ultra high vacuum condition. The third one is the mechanism of micro bump bonding applied to the electronic assemblies. The bump bonding is usually called "flip chip bonding (FCP)" and is applied to the chip scale packaging (CSP), which is very important for three dimensional packaging. The bump deformation behavior is visualized by numerical simulation. The bond area growth mechanism (slip and folding mechanism) is numerically analyzed. The last one is the ultrasonic bonding between Au wire and Al pad. The Al pad has a very strong thin oxide film on the surface. The breakdown of the oxide film is discussed based on the idea of the slip and folding mechanism. The effect of ultrasonic vibration on the low temperature solid state micro-joining process is also discussed.
citation_title	Environmentally Friendly Low Temperature Solid State Micro-joining
citation_author	Takahashi, Yasuo
citation_author	Maeda, Masakatsu
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2011-06
citation_journal_title	Transactions of JWRI
citation_volume	40
citation_issue	1
citation_firstpage	1
citation_lastpage	7
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/5785
citation_keywords	Room temperature bonding
	Micro-joining
	Flip chip bonding
	Chip scale packaging
	Ultrasonic bonding
	Solid state joining
	Environmentally benign technology
	Eco technology
	Electronic assembly

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