Environmentally Friendly Low Temperature Solid State Micro-joining

Takahashi, Yasuo; Maeda, Masakatsu

doi:https://doi.org/10.18910/5785

このアイテムのアクセス数:146件（2023-12-08 15:47 集計）

このアイテムへのリンクには次のURLをご利用ください: https://doi.org/10.18910/5785

このアイテムへのリンクには次のURLをご利用ください: https://hdl.handle.net/11094/5785

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jwri40_01_001	pdf	なし	363 KB	87	2012.09.22

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タイトル	Environmentally Friendly Low Temperature Solid State Micro-joining
著者	NRID 1000090374610 1000090374610 著者名 Takahashi, Yasuo
著者	NRID 1000000263327 1000000263327 著者名 Maeda, Masakatsu
キーワード等	Room temperature bonding
	Micro-joining
	Flip chip bonding
	Chip scale packaging
	Ultrasonic bonding
	Solid state joining
	Environmentally benign technology
	Eco technology
	Electronic assembly
抄録	The present review describes the low temperature solid state micro-joining applied to advanced electronics packaging. Four topics are introduced. The first one concerns the trend of semi-conductor packaging. The second one is the room temperature bonding carried out under an ultra high vacuum condition. The third one is the mechanism of micro bump bonding applied to the electronic assemblies. The bump bonding is usually called "flip chip bonding (FCP)" and is applied to the chip scale packaging (CSP), which is very important for three dimensional packaging. The bump deformation behavior is visualized by numerical simulation. The bond area growth mechanism (slip and folding mechanism) is numerically analyzed. The last one is the ultrasonic bonding between Au wire and Al pad. The Al pad has a very strong thin oxide film on the surface. The breakdown of the oxide film is discussed based on the idea of the slip and folding mechanism. The effect of ultrasonic vibration on the low temperature solid state micro-joining process is also discussed.
出版者	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
収録物名	Transactions of JWRI
巻(号)	40(1)
ページ	1-7
刊行年月	2011-06
言語	英語
ハンドルURL	https://hdl.handle.net/11094/5785
DOI	https://doi.org/10.18910/5785
PISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.40 No.1 (2011-06)

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2011, 40(1), p. 1-7
DC.title	Environmentally Friendly Low Temperature Solid State Micro-joining
DC.creator	Takahashi, Yasuo
DC.creator	Maeda, Masakatsu
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2011-06
DC.subject	Room temperature bonding
	Micro-joining
	Flip chip bonding
	Chip scale packaging
	Ultrasonic bonding
	Solid state joining
	Environmentally benign technology
	Eco technology
	Electronic assembly
DCTERMS.abstract	The present review describes the low temperature solid state micro-joining applied to advanced electronics packaging. Four topics are introduced. The first one concerns the trend of semi-conductor packaging. The second one is the room temperature bonding carried out under an ultra high vacuum condition. The third one is the mechanism of micro bump bonding applied to the electronic assemblies. The bump bonding is usually called "flip chip bonding (FCP)" and is applied to the chip scale packaging (CSP), which is very important for three dimensional packaging. The bump deformation behavior is visualized by numerical simulation. The bond area growth mechanism (slip and folding mechanism) is numerically analyzed. The last one is the ultrasonic bonding between Au wire and Al pad. The Al pad has a very strong thin oxide film on the surface. The breakdown of the oxide film is discussed based on the idea of the slip and folding mechanism. The effect of ultrasonic vibration on the low temperature solid state micro-joining process is also discussed.
DC.identifier	10.18910/5785
DC.format	application/pdf
citation_doi	https://doi.org/10.18910/5785
citation_title	Environmentally Friendly Low Temperature Solid State Micro-joining
citation_author	Takahashi, Yasuo
citation_author	Maeda, Masakatsu
citation_publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
citation_language	英語
citation_date	2011-06
citation_journal_title	Transactions of JWRI
citation_volume	40
citation_issue	1
citation_firstpage	1
citation_lastpage	7
citation_public_url	https://hdl.handle.net/11094/5785
citation_doi_detail	10.18910/5785

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