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論文情報
タイトル
Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
著者
Nishikawa, Hiroshi
Nishikawa, Hiroshi
Komatsu, Akira
Komatsu, Akira
Takemoto, Tadashi
Takemoto, Tadashi
キーワード等
Lead-free solder
Element addition
Joint strength
Ball shear test
Interface
抄録
The interfacial reaction between the solder/Cu plate and the joint strength of the solder joint with a Cu pad were investigated for both as-reflow and thermal exposed conditions in this study. Sn-3.5mass%Ag-xCo solders (x=0, 0.1, 0.5, 1.0 mass%) were specially prepared. A reaction test between solder and a Cu plate was performed to reveal the effect of the addition of Co to solder on the morphology of intermetallic compounds at the interface. A bump shear test of the solder joint on a Cu pad was carried out to evaluate the effect of the addition of Co to solder on the joint strength of the solder with a Cu pad. As a result of the reaction test, it was clear that the formation of an intermetallic compound (IMC) layer at the interface for Sn-3.5Ag-Co solders was quite different from that for binary Sn-3.5Ag solder. During the aging process at 423K, the growth rate of the IMC layer for Sn-3.5Ag-Co solders was slow compared to that for binary Sn-3.5Ag solder. As a result of the bump shear test, it was clear that there was little difference in the shear strength between a Sn-3.5Ag solder joint and Sn-3.5Ag-Co solder joints, though the IMC morphology at the interface was quite different.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
35
号
2
開始ページ
53
終了ページ
56
刊行年月
2006-12
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/6258
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.35 No.2 (2006-12)
論文詳細を表示
著者版フラグ
publisher
NII資源タイプ
紀要論文
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紀要論文
dcmi資源タイプ
text
DCTERMS.bibliographicCitation
Transactions of JWRI.35(2) P.53-P.56
DC.title
Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
DC.creator
Nishikawa, Hiroshi
Komatsu, Akira
Takemoto, Tadashi
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2006-12
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/6258
DC.subject
Lead-free solder
Element addition
Joint strength
Ball shear test
Interface
DCTERMS.abstract
The interfacial reaction between the solder/Cu plate and the joint strength of the solder joint with a Cu pad were investigated for both as-reflow and thermal exposed conditions in this study. Sn-3.5mass%Ag-xCo solders (x=0, 0.1, 0.5, 1.0 mass%) were specially prepared. A reaction test between solder and a Cu plate was performed to reveal the effect of the addition of Co to solder on the morphology of intermetallic compounds at the interface. A bump shear test of the solder joint on a Cu pad was carried out to evaluate the effect of the addition of Co to solder on the joint strength of the solder with a Cu pad. As a result of the reaction test, it was clear that the formation of an intermetallic compound (IMC) layer at the interface for Sn-3.5Ag-Co solders was quite different from that for binary Sn-3.5Ag solder. During the aging process at 423K, the growth rate of the IMC layer for Sn-3.5Ag-Co solders was slow compared to that for binary Sn-3.5Ag solder. As a result of the bump shear test, it was clear that there was little difference in the shear strength between a Sn-3.5Ag solder joint and Sn-3.5Ag-Co solder joints, though the IMC morphology at the interface was quite different.
citation_title
Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
citation_author
Nishikawa, Hiroshi
Komatsu, Akira
Takemoto, Tadashi
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2006-12
citation_journal_title
Transactions of JWRI
citation_volume
35
citation_issue
2
citation_firstpage
53
citation_lastpage
56
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/6258
citation_keywords
Lead-free solder
Element addition
Joint strength
Ball shear test
Interface