Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test

Nishikawa, Hiroshi; Komatsu, Akira; Takemoto, Tadashi

doi:https://doi.org/10.18910/6258

Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test

Nishikawa, Hiroshi; Komatsu, Akira; Takemoto, Tadashi

Transactions of JWRI, 2006, 35(2), 53-56

アクセス数:3,220件（2025-07-03 17:14 集計）

固定URL: https://doi.org/10.18910/6258

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タイトル	Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
著者	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 著者名 Nishikawa, Hiroshi
	著者名 Komatsu, Akira
	NRID 1000060093431 1000060093431 著者名 Takemoto, Tadashi
キーワード等	Lead-free solder
	Element addition
	Joint strength
	Ball shear test
	Interface
抄録	The interfacial reaction between the solder/Cu plate and the joint strength of the solder joint with a Cu pad were investigated for both as-reflow and thermal exposed conditions in this study. Sn-3.5mass%Ag-xCo solders (x=0, 0.1, 0.5, 1.0 mass%) were specially prepared. A reaction test between solder and a Cu plate was performed to reveal the effect of the addition of Co to solder on the morphology of intermetallic compounds at the interface. A bump shear test of the solder joint on a Cu pad was carried out to evaluate the effect of the addition of Co to solder on the joint strength of the solder with a Cu pad. As a result of the reaction test, it was clear that the formation of an intermetallic compound (IMC) layer at the interface for Sn-3.5Ag-Co solders was quite different from that for binary Sn-3.5Ag solder. During the aging process at 423K, the growth rate of the IMC layer for Sn-3.5Ag-Co solders was slow compared to that for binary Sn-3.5Ag solder. As a result of the bump shear test, it was clear that there was little difference in the shear strength between a Sn-3.5Ag solder joint and Sn-3.5Ag-Co solder joints, though the IMC morphology at the interface was quite different.
出版者	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
収録物名	Transactions of JWRI
巻(号)	35(2)
ページ	53-56
刊行年月	2006-12
言語	英語
ハンドルURL	https://hdl.handle.net/11094/6258
DOI	https://doi.org/10.18910/6258
PISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.35 No.2 (2006-12)

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2006, 35(2), p. 53-56
DC.title	Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
DC.creator	Nishikawa, Hiroshi
	Komatsu, Akira
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2006-12
DC.subject	Lead-free solder
	Element addition
	Joint strength
	Ball shear test
	Interface
DCTERMS.abstract	The interfacial reaction between the solder/Cu plate and the joint strength of the solder joint with a Cu pad were investigated for both as-reflow and thermal exposed conditions in this study. Sn-3.5mass%Ag-xCo solders (x=0, 0.1, 0.5, 1.0 mass%) were specially prepared. A reaction test between solder and a Cu plate was performed to reveal the effect of the addition of Co to solder on the morphology of intermetallic compounds at the interface. A bump shear test of the solder joint on a Cu pad was carried out to evaluate the effect of the addition of Co to solder on the joint strength of the solder with a Cu pad. As a result of the reaction test, it was clear that the formation of an intermetallic compound (IMC) layer at the interface for Sn-3.5Ag-Co solders was quite different from that for binary Sn-3.5Ag solder. During the aging process at 423K, the growth rate of the IMC layer for Sn-3.5Ag-Co solders was slow compared to that for binary Sn-3.5Ag solder. As a result of the bump shear test, it was clear that there was little difference in the shear strength between a Sn-3.5Ag solder joint and Sn-3.5Ag-Co solder joints, though the IMC morphology at the interface was quite different.
DC.identifier	10.18910/6258
DC.format	6258
citation_title	Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
citation_author	Nishikawa, Hiroshi
	Komatsu, Akira
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2006-12
citation_journal_title	Transactions of JWRI
citation_volume	35
citation_issue	2
citation_firstpage	53
citation_lastpage	56
citation_public_url	https://hdl.handle.net/11094/6258
citation_doi_detail	10.18910/6258
citation_doi	https://doi.org/10.18910/6258

Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test

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