Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

Cheng, Fangjie; Nishikawa, Hiroshi; Takemoto, Tadashi

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タイトル	Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
著者	Cheng, Fangjie Cheng, Fangjie
	Nishikawa, Hiroshi Nishikawa, Hiroshi
	Takemoto, Tadashi Takemoto, Tadashi
キーワード等	Lead-free solder
	Isothermal aging
	Minor element addition
	Microstructure
	Tensile behavior
抄録	The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	36
号	1
開始ページ	53
終了ページ	56
刊行年月	2007-07
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/7653
言語	英語

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.36(1) P.53-P.56
DC.title	Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
DC.creator	Cheng, Fangjie
	Nishikawa, Hiroshi
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2007-07
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/7653
DC.subject	Lead-free solder
	Isothermal aging
	Minor element addition
	Microstructure
	Tensile behavior
DCTERMS.abstract	The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
citation_title	Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
citation_author	Cheng, Fangjie
	Nishikawa, Hiroshi
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2007-07
citation_journal_title	Transactions of JWRI
citation_volume	36
citation_issue	1
citation_firstpage	53
citation_lastpage	56
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/7653
citation_keywords	Lead-free solder
	Isothermal aging
	Minor element addition
	Microstructure
	Tensile behavior

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