紀要論文

紀要論文

text

Transactions of JWRI. 2007, 36(1), p. 53-56

Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

英語

text

2007-07

The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.

10.18910/7653

7653

Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

大阪大学接合科学研究所

英語

2007-07

Transactions of JWRI

36

1

53

56

https://hdl.handle.net/11094/7653

10.18910/7653

https://doi.org/10.18910/7653