Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

Cheng, Fangjie; Nishikawa, Hiroshi; Takemoto, Tadashi

doi:https://doi.org/10.18910/7653

このアイテムのアクセス数:188件（2023-12-01 00:02 集計）

このアイテムへのリンクには次のURLをご利用ください: https://doi.org/10.18910/7653

このアイテムへのリンクには次のURLをご利用ください: https://hdl.handle.net/11094/7653

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タイトル	Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
著者	著者名 Cheng, Fangjie
	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 著者名 Nishikawa, Hiroshi
	NRID 1000060093431 1000060093431 著者名 Takemoto, Tadashi
キーワード等	Lead-free solder
	Isothermal aging
	Minor element addition
	Microstructure
	Tensile behavior
抄録	The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
出版者	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
収録物名	Transactions of JWRI
巻(号)	36(1)
ページ	53-56
刊行年月	2007-07
言語	英語
ハンドルURL	https://hdl.handle.net/11094/7653
DOI	https://doi.org/10.18910/7653
PISSN	03874508
NCID	AA00867058
アクセス権	open access
出版タイプ	Version of Record
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.36 No.1 (2007-07)

資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2007, 36(1), p. 53-56
DC.title	Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
DC.creator	Cheng, Fangjie
	Nishikawa, Hiroshi
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2007-07
DC.subject	Lead-free solder
	Isothermal aging
	Minor element addition
	Microstructure
	Tensile behavior
DCTERMS.abstract	The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
DC.identifier	10.18910/7653
DC.format	application/pdf
citation_doi	https://doi.org/10.18910/7653
citation_title	Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
citation_author	Cheng, Fangjie
	Nishikawa, Hiroshi
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
citation_language	英語
citation_date	2007-07
citation_journal_title	Transactions of JWRI
citation_volume	36
citation_issue	1
citation_firstpage	53
citation_lastpage	56
citation_public_url	https://hdl.handle.net/11094/7653
citation_doi_detail	10.18910/7653

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