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jwri36_01_053
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論文情報
タイトル
Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
著者
Cheng, Fangjie
Cheng, Fangjie
Nishikawa, Hiroshi
Nishikawa, Hiroshi
Takemoto, Tadashi
Takemoto, Tadashi
キーワード等
Lead-free solder
Isothermal aging
Minor element addition
Microstructure
Tensile behavior
抄録
The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
36
号
1
開始ページ
53
終了ページ
56
刊行年月
2007-07
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/7653
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.36 No.1 (2007-07)
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.36(1) P.53-P.56
DC.title
Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
DC.creator
Cheng, Fangjie
Nishikawa, Hiroshi
Takemoto, Tadashi
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2007-07
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/7653
DC.subject
Lead-free solder
Isothermal aging
Minor element addition
Microstructure
Tensile behavior
DCTERMS.abstract
The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
citation_title
Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
citation_author
Cheng, Fangjie
Nishikawa, Hiroshi
Takemoto, Tadashi
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2007-07
citation_journal_title
Transactions of JWRI
citation_volume
36
citation_issue
1
citation_firstpage
53
citation_lastpage
56
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/7653
citation_keywords
Lead-free solder
Isothermal aging
Minor element addition
Microstructure
Tensile behavior