Effect of Halogenation Treatment to Solder on Anodic Soldering

Takahashi, Makoto; Ikeuchi, Kenji

Transactions of JWRI, 2008, 37(1), 39-43

アクセス数:422件（2025-07-06 10:25 集計）

固定URL: https://doi.org/10.18910/8309

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論文情報

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タイトル
Effect of Halogenation Treatment to Solder on Anodic Soldering
著者
NRID
1000010294133 1000010294133
researchmap permalink
AB_MTakahashi AB_MTakahashi
Scopus Author ID
55701142600 55701142600
著者名
Takahashi, Makoto
NRID
1000010030058 1000010030058
著者名
Ikeuchi, Kenji
キーワード等
soldering
anodic bonding
oxide layer
halogenation treatment
leadfree solder
borosilicate glass
抄録
The effect of the halogenation treatment of tin based solder on the wettability of tin based solder to glass was examined, and that treatment was applied to anodic soldering - soldering of glass utilizing the principle of anodic bonding. The halogenation treatment by hydrogen chloride vapor considerably improves wettability of pure tin solder and Sn-3.5mass%Ag solder to glass. In anodic soldering, the halogenation treatment improves the spread of solder at the joint interface. In anodic soldering using pure tin solder receiving the halogenation treatment, application of voltage improved the strength of produced joints. But too long application of voltage was harmful to soundness of the joints. This was thought to be caused by excess growth of the oxide layer at the joint interface. In soldering using Sn-3.5mass%Ag solder, the effect of the voltage application was not clear.
出版者
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
収録物名
Transactions of JWRI
巻(号)
37(1)
ページ
39-43
刊行年月
2008-07
言語
英語
ハンドルURL
https://hdl.handle.net/11094/8309
DOI
https://doi.org/10.18910/8309
PISSN
03874508
NCID
AA00867058
アクセス権
open access
出版タイプ
Version of Record
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.37 No.1 (2008-07)