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jwri37_01_039
pdf
284 KB
35
論文情報
タイトル
Effect of Halogenation Treatment to Solder on Anodic Soldering
著者
Takahashi, Makoto
Takahashi, Makoto
Ikeuchi, Kenji
Ikeuchi, Kenji
キーワード等
soldering
anodic bonding
oxide layer
halogenation treatment
leadfree solder
borosilicate glass
抄録
The effect of the halogenation treatment of tin based solder on the wettability of tin based solder to glass was examined, and that treatment was applied to anodic soldering - soldering of glass utilizing the principle of anodic bonding. The halogenation treatment by hydrogen chloride vapor considerably improves wettability of pure tin solder and Sn-3.5mass%Ag solder to glass. In anodic soldering, the halogenation treatment improves the spread of solder at the joint interface. In anodic soldering using pure tin solder receiving the halogenation treatment, application of voltage improved the strength of produced joints. But too long application of voltage was harmful to soundness of the joints. This was thought to be caused by excess growth of the oxide layer at the joint interface. In soldering using Sn-3.5mass%Ag solder, the effect of the voltage application was not clear.
公開者
大阪大学接合科学研究所
公開者の別表記
Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
掲載誌名
Transactions of JWRI
巻
37
号
1
開始ページ
39
終了ページ
43
刊行年月
2008-07
ISSN
03874508
NCID
AA00867058
URL
http://hdl.handle.net/11094/8309
言語
英語
カテゴリ
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.37 No.1 (2008-07)
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著者版フラグ
publisher
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text
DCTERMS.bibliographicCitation
Transactions of JWRI.37(1) P.39-P.43
DC.title
Effect of Halogenation Treatment to Solder on Anodic Soldering
DC.creator
Takahashi, Makoto
Ikeuchi, Kenji
DC.publisher
大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766
英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF
2008-07
DC.identifier" scheme="DCTERMS.URI
http://hdl.handle.net/11094/8309
DC.subject
soldering
anodic bonding
oxide layer
halogenation treatment
leadfree solder
borosilicate glass
DCTERMS.abstract
The effect of the halogenation treatment of tin based solder on the wettability of tin based solder to glass was examined, and that treatment was applied to anodic soldering - soldering of glass utilizing the principle of anodic bonding. The halogenation treatment by hydrogen chloride vapor considerably improves wettability of pure tin solder and Sn-3.5mass%Ag solder to glass. In anodic soldering, the halogenation treatment improves the spread of solder at the joint interface. In anodic soldering using pure tin solder receiving the halogenation treatment, application of voltage improved the strength of produced joints. But too long application of voltage was harmful to soundness of the joints. This was thought to be caused by excess growth of the oxide layer at the joint interface. In soldering using Sn-3.5mass%Ag solder, the effect of the voltage application was not clear.
citation_title
Effect of Halogenation Treatment to Solder on Anodic Soldering
citation_author
Takahashi, Makoto
Ikeuchi, Kenji
citation_publisher
大阪大学接合科学研究所
citation_language
英語
citation_date
2008-07
citation_journal_title
Transactions of JWRI
citation_volume
37
citation_issue
1
citation_firstpage
39
citation_lastpage
43
citation_issn
03874508
citation_public_url
http://hdl.handle.net/11094/8309
citation_keywords
soldering
anodic bonding
oxide layer
halogenation treatment
leadfree solder
borosilicate glass