Effect of Halogenation Treatment to Solder on Anodic Soldering

Takahashi, Makoto; Ikeuchi, Kenji

このアイテムのアクセス数:31件（2021-03-02 05:55 集計）

このアイテムへのリンクには次のURLをご利用ください:http://hdl.handle.net/11094/8309

閲覧可能ファイル

ファイル	フォーマット	サイズ	閲覧回数	説明
jwri37_01_039	pdf	284 KB	35

論文情報

タイトル	Effect of Halogenation Treatment to Solder on Anodic Soldering
著者	Takahashi, Makoto Takahashi, Makoto
著者	Ikeuchi, Kenji Ikeuchi, Kenji
キーワード等	soldering
	anodic bonding
	oxide layer
	halogenation treatment
	leadfree solder
	borosilicate glass
抄録	The effect of the halogenation treatment of tin based solder on the wettability of tin based solder to glass was examined, and that treatment was applied to anodic soldering - soldering of glass utilizing the principle of anodic bonding. The halogenation treatment by hydrogen chloride vapor considerably improves wettability of pure tin solder and Sn-3.5mass%Ag solder to glass. In anodic soldering, the halogenation treatment improves the spread of solder at the joint interface. In anodic soldering using pure tin solder receiving the halogenation treatment, application of voltage improved the strength of produced joints. But too long application of voltage was harmful to soundness of the joints. This was thought to be caused by excess growth of the oxide layer at the joint interface. In soldering using Sn-3.5mass%Ag solder, the effect of the voltage application was not clear.
公開者	大阪大学接合科学研究所
公開者の別表記	Joining and Welding Research Institute, Osaka University
公開者 (ヨミ)	オオサカダイガクセツゴウカガクケンキュウジョ
掲載誌名	Transactions of JWRI
巻	37
号	1
開始ページ	39
終了ページ	43
刊行年月	2008-07
ISSN	03874508
NCID	AA00867058
URL	http://hdl.handle.net/11094/8309
言語	英語
カテゴリ	紀要論文 Departmental Bulletin Paper
カテゴリ	Transactions of JWRI / Vol.37 No.1 (2008-07)

著者版フラグ	publisher
NII資源タイプ	紀要論文
ローカル資源タイプ	紀要論文
dcmi資源タイプ	text
DCTERMS.bibliographicCitation	Transactions of JWRI.37(1) P.39-P.43
DC.title	Effect of Halogenation Treatment to Solder on Anodic Soldering
DC.creator	Takahashi, Makoto
DC.creator	Ikeuchi, Kenji
DC.publisher	大阪大学接合科学研究所
DC.language" scheme="DCTERMS.RFC1766	英語
DCTERMS.issued" scheme="DCTERMS.W3CDTF	2008-07
DC.identifier" scheme="DCTERMS.URI	http://hdl.handle.net/11094/8309
DC.subject	soldering
	anodic bonding
	oxide layer
	halogenation treatment
	leadfree solder
	borosilicate glass
DCTERMS.abstract	The effect of the halogenation treatment of tin based solder on the wettability of tin based solder to glass was examined, and that treatment was applied to anodic soldering - soldering of glass utilizing the principle of anodic bonding. The halogenation treatment by hydrogen chloride vapor considerably improves wettability of pure tin solder and Sn-3.5mass%Ag solder to glass. In anodic soldering, the halogenation treatment improves the spread of solder at the joint interface. In anodic soldering using pure tin solder receiving the halogenation treatment, application of voltage improved the strength of produced joints. But too long application of voltage was harmful to soundness of the joints. This was thought to be caused by excess growth of the oxide layer at the joint interface. In soldering using Sn-3.5mass%Ag solder, the effect of the voltage application was not clear.
citation_title	Effect of Halogenation Treatment to Solder on Anodic Soldering
citation_author	Takahashi, Makoto
citation_author	Ikeuchi, Kenji
citation_publisher	大阪大学接合科学研究所
citation_language	英語
citation_date	2008-07
citation_journal_title	Transactions of JWRI
citation_volume	37
citation_issue	1
citation_firstpage	39
citation_lastpage	43
citation_issn	03874508
citation_public_url	http://hdl.handle.net/11094/8309
citation_keywords	soldering
	anodic bonding
	oxide layer
	halogenation treatment
	leadfree solder
	borosilicate glass

閲覧可能ファイル

論文情報

論文詳細を表示