Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy

Ogi, H.; Yamamoto, A.; Kondou, K.; Nakano, K.; Morita, K.; Nakamura, N.; Ono, T.; Hirao, M.

doi:https://doi.org/10.1103/PhysRevB.82.155436

Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy

Ogi, H.; Yamamoto, A.; Kondou, K. et al.

Physical Review B - Condensed Matter and Materials Physics, 2010, 82(15), 155436-1-155436-5

アクセス数:720件（2025-07-30 14:23 集計）

固定URL: https://hdl.handle.net/11094/84180

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タイトル	Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy
著者	NRID 1000090252626 1000090252626 researchmap permalink read0042771 read0042771 Scopus Author ID 35563683500 35563683500 著者名 Ogi, H.
	著者名 Yamamoto, A.
	著者名 Kondou, K.
	著者名 Nakano, K.
	著者名 Morita, K.
	NRID 1000050452404 1000050452404 researchmap permalink nnakamura nnakamura Scopus Author ID 7403356186 7403356186 ORCID 0000-0002-5338-842X 0000-0002-5338-842X 著者名 Nakamura, N.
	NRID 1000090296749 1000090296749 著者名 Ono, T.
	NRID 1000080112027 1000080112027 著者名 Hirao, M.
内容	Ogi H., Yamamoto A., Kondou K., et al. "Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy", Physical Review B - Condensed Matter and Materials Physics, 82(15), 155436, 2010. https://doi.org/10.1103/PhysRevB.82.155436.
抄録	High-frequency vibrations related with copper nanowires on a silicon substrate are studied using picosecond ultrasound spectroscopy. The reflectivity change in the probe light pulse is monitored after irradiation of the specimen with the ultrafast light pulse, showing high (∼75 GHz) and low (<∼15 GHz) frequency vibrations, which are identified to be thickness resonance of nanowires and collective-mode resonances on the substrate, respectively. The nanowires are subjected to the current-loading test to induce electromigration. The thickness resonance frequency significantly decreases as the progress of the electromigration while the other frequencies and the resistance remain nearly unchanged. The micromechanics analysis and the vacancy diffusion theory indicate the growth of thin defects at grain boundaries for softening the nanowires. © 2010 The American Physical Society.
出版者	American Physical Society
収録物名	Physical Review B - Condensed Matter and Materials Physics
巻(号)	82(15)
ページ	155436-1-155436-5
刊行年月	2010-10-19
言語	英語
ハンドルURL	https://hdl.handle.net/11094/84180
PISSN	10980121
eISSN	1550235X
NCID	AA11187113
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1103/PhysRevB.82.155436
アクセス権	open access
権利情報	Copyright 2010 by the American Physical Society
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	Physical Review B - Condensed Matter and Materials Physics. 2010, 82(15), p. 155436-1-155436-5
DC.title	Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy
DC.creator	Ogi, H.
	Yamamoto, A.
	Kondou, K.
	Nakano, K.
	Morita, K.
	Nakamura, N.
	Ono, T.
	Hirao, M.
DC.publisher	American Physical Society
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2010-10-19
DC.identifier	https://doi.org/10.1103/PhysRevB.82.155436
DC.description	Ogi H., Yamamoto A., Kondou K., et al. "Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy", Physical Review B - Condensed Matter and Materials Physics, 82(15), 155436, 2010. https://doi.org/10.1103/PhysRevB.82.155436.
DCTERMS.abstract	High-frequency vibrations related with copper nanowires on a silicon substrate are studied using picosecond ultrasound spectroscopy. The reflectivity change in the probe light pulse is monitored after irradiation of the specimen with the ultrafast light pulse, showing high (∼75 GHz) and low (<∼15 GHz) frequency vibrations, which are identified to be thickness resonance of nanowires and collective-mode resonances on the substrate, respectively. The nanowires are subjected to the current-loading test to induce electromigration. The thickness resonance frequency significantly decreases as the progress of the electromigration while the other frequencies and the resistance remain nearly unchanged. The micromechanics analysis and the vacancy diffusion theory indicate the growth of thin defects at grain boundaries for softening the nanowires. © 2010 The American Physical Society.
DC.rights	Copyright 2010 by the American Physical Society
DC.format	84180
citation_title	Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy
citation_author	Ogi, H.
	Yamamoto, A.
	Kondou, K.
	Nakano, K.
	Morita, K.
	Nakamura, N.
	Ono, T.
	Hirao, M.
citation_publisher	American Physical Society
citation_language	英語
citation_date	2010-10-19
citation_journal_title	Physical Review B - Condensed Matter and Materials Physics
citation_volume	82
citation_issue	15
citation_firstpage	155436-1
citation_lastpage	155436-5
citation_doi	https://doi.org/10.1103/PhysRevB.82.155436
citation_public_url	https://hdl.handle.net/11094/84180

Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy

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