学術雑誌論文

学術雑誌論文

text

Review of Scientific Instruments. 2020, 91(4), p. 045108

An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating

American Institute of Physics

英語

text

2020-04-13

https://doi.org/10.1063/1.5141381

Daisetsu Toh, Pho Van Bui, Ai Isohashi, Satoshi Matsuyama, Kazuto Yamauchi, and Yasuhisa Sano, "An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating", Review of Scientific Instruments 91, 045108 (2020), https://doi.org/10.1063/1.5141381.

An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic disturbance. In this study, we propose a new CARE method using a Ni catalyst with in situ electrochemical plating and dissolution, which enable enhancing the catalytic capability of Ni. This method has advantages to realize more than ten times higher removal rate and better stability compared with the conventional CARE method.

This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in (citation of published article) and may be found at https://doi.org/10.1063/1.5141381.

86964

An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating

American Institute of Physics

英語

2020-04-13

Review of Scientific Instruments

91

4

045108

https://doi.org/10.1063/1.5141381

https://hdl.handle.net/11094/86964