Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol

Matsuda, Tomoki; Yamada, Seigo; Okubo, Shio et al.

Journal of Materials Science, 2023, 58(40), 15617-15633

アクセス数:554件（2026-04-06 04:21 集計）

固定URL: https://hdl.handle.net/11094/93223

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タイトル
Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol
著者
NRID
1000050419206 1000050419206
researchmap permalink
tikimaz tikimaz
Scopus Author ID
7404349300 7404349300
著者名
Matsuda, Tomoki
著者名
Yamada, Seigo
著者名
Okubo, Shio
NRID
1000070144433 1000070144433
Scopus Author ID
7102226286 7102226286
researchmap permalink
read0014056 read0014056
著者名
Hirose, Akio
内容
The version of record of this article, first published in Journal of Materials Science, is available online at Publisher’s website: https://doi.org/10.1007/s10853-023-08976-5
抄録
Durability of sintered Cu joints under thermal aging in the air was investigated for the reduction of Cu₂O using Cu₂O/polyethylene glycol (PEG) mixture. Thermal analysis of the Cu₂O/PEG paste showed that the molecular weight of PEG influences the redox reaction and the subsequent bonding related to the combustion of the reducing organic solvent. Sintered Cu joints using PEG 400 exhibited high joint strength (above 30 MPa) in shear tests, even for the bonding temperature of 280 °C. The sintered Cu joints exhibited slightly increased strength during thermal aging at 250 °C in air, which was also confirmed by the microscale tensile test used for evaluating the fracture behavior of the sintered Cu structure. Microstructural analysis, including the evaluation of the crystal orientation, revealed a small change in the microstructure of sintered joints during aging. Transmission electron microscopy revealed the presence of organic membranes on slightly oxidized sintered Cu grains before thermal aging, and additional oxidation was observed after thermal aging. The progress of sintering during thermal aging in vacuum was different than that in air. It was considered that the formation of a thin Cu₂O layer, controlled by the presence of organic membranes, contributed to the suppression of Cu sintering.
出版者
Springer
収録物名
Journal of Materials Science
巻(号)
58(40)
ページ
15617-15633
刊行年月
2023-10-19
言語
英語
ハンドルURL
https://hdl.handle.net/11094/93223
PISSN
00222461
eISSN
15734803
関連情報 (isIdenticalTo)
DOI (出版社版)
https://doi.org/10.1007/s10853-023-08976-5
アクセス権
open access
権利情報
This article is licensed under a Creative Commons Attribution 4.0 International License.
出版タイプ
Version of Record
カテゴリ
学術雑誌論文 Journal Article