Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining

Takenaka, Kosuke; Jinda, Akiya; Nakamoto, Soutaro; Koyari, Ryosuke; Toko, Susumu; Uchida, Giichiro; Setsuhara, Yuichi

doi:https://doi.org/10.1007/s00170-023-12747-6

Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining

Takenaka, Kosuke; Jinda, Akiya; Nakamoto, Soutaro et al.

International Journal of Advanced Manufacturing Technology, 2023, 130(1-2), 903-913

アクセス数:556件（2025-08-15 22:58 集計）

固定URL: https://hdl.handle.net/11094/93406

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タイトル	Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining
著者	NRID 1000060432423 1000060432423 researchmap permalink takenaka takenaka Scopus Author ID 18635173500 18635173500 著者名 Takenaka, Kosuke
	著者名 Jinda, Akiya
	著者名 Nakamoto, Soutaro
	著者名 Koyari, Ryosuke
	著者名 Toko, Susumu
	NRID 1000090422435 1000090422435 著者名 Uchida, Giichiro
	NRID 1000080236108 1000080236108 著者名 Setsuhara, Yuichi
キーワード等	Atmospheric pressure plasma
	Direct joint
	Dissimilar material joining
内容	The version of record of this article, first published in International Journal of Advanced Manufacturing Technology, is available online at Publisher’s website: https://doi.org/10.1007/s00170-023-12747-6
抄録	The direct bonding of A5052 aluminum (Al) alloy to the engineering polymer poly(ether ether ketone) (PEEK) using an atmospheric pressure plasma-assisted process was demonstrated. The effect of plasma irradiation on the bonding surface of metal resin on the bonding strength following thermal press fitting method was investigated. Specimens bonded by plasma irradiation on the PEEK surface only showed a high tensile shear stress of 15.5 MPa. With increasing plasma irradiation time, the bond strength of the samples bonded to the PEEK surface by plasma irradiation increased. The increase in the bond strength between metals and polymers following direct bonding is caused by the addition of oxygen functional groups on the polymer. In contrast, specimens in which only the Al was exposed to the plasma showed a decrease in bond strength compared with unirradiated samples. This reduction in bond strength is attributed to the forming magnesium oxide, which forms in the early stages of participation due to plasma irradiation.
出版者	Springer Science and Business Media Deutschland GmbH
収録物名	International Journal of Advanced Manufacturing Technology
巻(号)	130(1-2)
ページ	903-913
刊行年月	2023-12-06
言語	英語
ハンドルURL	https://hdl.handle.net/11094/93406
PISSN	02683768
eISSN	14333015
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1007/s00170-023-12747-6
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCMI資源タイプ	text
DCTERMS.bibliographicCitation	International Journal of Advanced Manufacturing Technology. 2023, 130(1-2), p. 903-913
DC.title	Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining
DC.creator	Takenaka, Kosuke
	Jinda, Akiya
	Nakamoto, Soutaro
	Koyari, Ryosuke
	Toko, Susumu
	Uchida, Giichiro
	Setsuhara, Yuichi
DC.publisher	Springer Science and Business Media Deutschland GmbH
DC.language' scheme='DCTERMS.RFC1766	英語
DC.type' scheme='DCTERMS.DCMIType	text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2023-12-06
DC.identifier	https://doi.org/10.1007/s00170-023-12747-6
DC.subject	Atmospheric pressure plasma
	Direct joint
	Dissimilar material joining
DC.description	The version of record of this article, first published in International Journal of Advanced Manufacturing Technology, is available online at Publisher’s website: https://doi.org/10.1007/s00170-023-12747-6
DCTERMS.abstract	The direct bonding of A5052 aluminum (Al) alloy to the engineering polymer poly(ether ether ketone) (PEEK) using an atmospheric pressure plasma-assisted process was demonstrated. The effect of plasma irradiation on the bonding surface of metal resin on the bonding strength following thermal press fitting method was investigated. Specimens bonded by plasma irradiation on the PEEK surface only showed a high tensile shear stress of 15.5 MPa. With increasing plasma irradiation time, the bond strength of the samples bonded to the PEEK surface by plasma irradiation increased. The increase in the bond strength between metals and polymers following direct bonding is caused by the addition of oxygen functional groups on the polymer. In contrast, specimens in which only the Al was exposed to the plasma showed a decrease in bond strength compared with unirradiated samples. This reduction in bond strength is attributed to the forming magnesium oxide, which forms in the early stages of participation due to plasma irradiation.
DC.rights	This article is licensed under a Creative Commons Attribution 4.0 International License.
DC.format	93406
citation_title	Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining
citation_author	Takenaka, Kosuke
	Jinda, Akiya
	Nakamoto, Soutaro
	Koyari, Ryosuke
	Toko, Susumu
	Uchida, Giichiro
	Setsuhara, Yuichi
citation_publisher	Springer Science and Business Media Deutschland GmbH
citation_language	英語
citation_date	2023-12-06
citation_journal_title	International Journal of Advanced Manufacturing Technology
citation_volume	130
citation_issue	1-2
citation_firstpage	903
citation_lastpage	913
citation_doi	https://doi.org/10.1007/s00170-023-12747-6
citation_public_url	https://hdl.handle.net/11094/93406

Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining

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