Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module

Huo, Fupeng; Chen, Chuantong; Zhang, Zheng; Zhang, Yicheng; Suetake, Aiji; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki

doi:https://doi.org/10.1016/j.matchar.2024.114360

Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module

Huo, Fupeng; Chen, Chuantong; Zhang, Zheng et al.

Materials Characterization, 2024, 217, 114360

アクセス数:715件（2025-07-27 21:07 集計）

固定URL: https://hdl.handle.net/11094/98431

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タイトル	Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module
著者	著者名 Huo, Fupeng
	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 著者名 Chen, Chuantong
	NRID 1000010889314 1000010889314 ORCID 0000-0002-4201-3120 0000-0002-4201-3120 researchmap permalink 061516 061516 Scopus Author ID 57202582942 57202582942 著者名 Zhang, Zheng
	著者名 Zhang, Yicheng
	著者名 Suetake, Aiji
	著者名 Takeshita, Kazutaka
	著者名 Yamaguchi, Yoshiji
	著者名 Momose, Yashima
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma 著者名 Suganuma, Katsuaki
キーワード等	Interface
	Sintering
	Sustained release effect
	TEM
	Thermal shock
内容	Huo F., Chen C., Zhang Z., et al. Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module. Materials Characterization 217, 114360 (2024); https://doi.org/10.1016/j.matchar.2024.114360.
抄録	To meet the harsh thermal shock (−50–250 °C) requirements of power device packaging, a novel sintered Ag-based die attach material based on the sustained release effect of Al was proposed. In this study, Al particles with natural core-shell structure covered with Al₂O₃ layer were selected as the ideal doping-phase, and micron Al particles doped sintered Ag composite paste (AgAl) was prepared. First, the microstructural evolution of sintered AgAl joints during thermal shock was studied. The results showed that Al particles effectively suppressed the cracks generation, which attributed to the sustained release effect of Al element. To clarify sustained release mechanism of Al, the interfaces evolution between Ag and Al particles was investigated. In the initial stage, Al was covered by the Al₂O₃ layer, preventing inter-diffusion between Ag and Al. As the thermal shock proceeds, the Al₂O₃ film was fractured, achieving direct contact between metal Al and Ag. Diffusion thus takes place. For the sintered Ag5Al joint, the shear strength was 17.3 MPa after 1000 cycles, which is 1.57 times that of pure sintered Ag joint. These results indicate the successful development of low-cost, high-reliability die attachment materials for use in harsh thermal shock environments.
出版者	Elsevier Inc.
収録物名	Materials Characterization
巻(号)	217
ページ	114360
刊行年月	2024-11-01
言語	英語
ハンドルURL	https://hdl.handle.net/11094/98431
PISSN	10445803
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1016/j.matchar.2024.114360
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCTERMS.bibliographicCitation	Materials Characterization. 2024, 217, p. 114360
DC.title	Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module
DC.creator	Huo, Fupeng
	Chen, Chuantong
	Zhang, Zheng
	Zhang, Yicheng
	Suetake, Aiji
	Takeshita, Kazutaka
	Yamaguchi, Yoshiji
	Momose, Yashima
	Suganuma, Katsuaki
DC.publisher	Elsevier Inc.
DC.language' scheme='DCTERMS.RFC1766	英語
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2024-11-01
DC.identifier	https://doi.org/10.1016/j.matchar.2024.114360
DC.subject	Interface
	Sintering
	Sustained release effect
	TEM
	Thermal shock
DC.description	Huo F., Chen C., Zhang Z., et al. Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module. Materials Characterization 217, 114360 (2024); https://doi.org/10.1016/j.matchar.2024.114360.
DCTERMS.abstract	To meet the harsh thermal shock (−50–250 °C) requirements of power device packaging, a novel sintered Ag-based die attach material based on the sustained release effect of Al was proposed. In this study, Al particles with natural core-shell structure covered with Al₂O₃ layer were selected as the ideal doping-phase, and micron Al particles doped sintered Ag composite paste (AgAl) was prepared. First, the microstructural evolution of sintered AgAl joints during thermal shock was studied. The results showed that Al particles effectively suppressed the cracks generation, which attributed to the sustained release effect of Al element. To clarify sustained release mechanism of Al, the interfaces evolution between Ag and Al particles was investigated. In the initial stage, Al was covered by the Al₂O₃ layer, preventing inter-diffusion between Ag and Al. As the thermal shock proceeds, the Al₂O₃ film was fractured, achieving direct contact between metal Al and Ag. Diffusion thus takes place. For the sintered Ag5Al joint, the shear strength was 17.3 MPa after 1000 cycles, which is 1.57 times that of pure sintered Ag joint. These results indicate the successful development of low-cost, high-reliability die attachment materials for use in harsh thermal shock environments.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.format	98431
citation_title	Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module
citation_author	Huo, Fupeng
	Chen, Chuantong
	Zhang, Zheng
	Zhang, Yicheng
	Suetake, Aiji
	Takeshita, Kazutaka
	Yamaguchi, Yoshiji
	Momose, Yashima
	Suganuma, Katsuaki
citation_publisher	Elsevier Inc.
citation_language	英語
citation_date	2024-11-01
citation_journal_title	Materials Characterization
citation_volume	217
citation_firstpage	114360
citation_doi	https://doi.org/10.1016/j.matchar.2024.114360
citation_public_url	https://hdl.handle.net/11094/98431

Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module

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