Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique

Mori, Naoki; Hakkaku, Toru; Hayashi, Takahiro

doi:https://doi.org/10.1088/1361-6501/ad8f51

Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique

Mori, Naoki; Hakkaku, Toru; Hayashi, Takahiro

Measurement Science and Technology, 2024, 36, 015605

アクセス数:407件（2025-08-14 16:34 集計）

固定URL: https://hdl.handle.net/11094/98532

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タイトル	Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique
著者	NRID 1000000802092 1000000802092 ORCID 0000-0002-0707-3443 0000-0002-0707-3443 researchmap permalink 7000020478 7000020478 Scopus Author ID 55614094500 55614094500 著者名 Mori, Naoki
	著者名 Hakkaku, Toru
	NRID 1000030324479 1000030324479 ORCID 0000-0001-6064-4658 0000-0001-6064-4658 researchmap permalink takahiro_hayashi takahiro_hayashi Scopus Author ID 37064150200 37064150200 著者名 Hayashi, Takahiro
キーワード等	Adhesive curing
	Ultrasonic wave
	Layer resonance
	Spectral analysis
	Viscoelasticity
内容	This is the Accepted Manuscript version of an article accepted for publication in Measurement Science and Technology. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6501/ad8f51.
抄録	Layer resonance induced by ultrasonic wave incidence is applied to monitor the viscoelastic properties of a curing adhesive layer between metal plates. A theoretical analysis shows that when the adhesive layer is modeled as a linear viscoelastic material, the ultrasonic reflection spectrum takes local minima at the layer resonance frequencies depending on the wave velocity of the adhesive. In contrast, the local minima of the reflection spectrum can be expressed as a function of the loss factor of the adhesive. Based on these results, a characterization technique for the wave velocity and the loss factor of a curing adhesive layer is proposed. This technique enables the evaluation of viscoelastic properties even if the reflected waves from both faces of a bond layer cannot be separated. The proposed method is used to investigate the curing behavior of bi-component epoxy adhesives. It is shown that the bonding condition affects the variation of the wave velocity and loss factor. The estimated wave velocity increases as the curing proceeds, whereas the loss factor sometimes takes a local maximum depending on the bonding condition and the frequency range. When the mixing ratio of the main and curing agents is imbalanced, the variation of the wave velocity becomes gradual. Furthermore, the increase in the curing temperature leads to fast changes in the wave velocity and loss factor. The proposed technique has the potential to provide insights into the curing behavior of the adhesive layer by incorporating it into other measurement methods and theories.
出版者	IOP Publishing
収録物名	Measurement Science and Technology
巻(号)	36
ページ	015605
刊行年月	2024-11-22
言語	英語
ハンドルURL	https://hdl.handle.net/11094/98532
PISSN	09570233
eISSN	13616501
関連情報 (isVersionOf)	DOI (出版社版) https://doi.org/10.1088/1361-6501/ad8f51
アクセス権	embargoed access
権利情報	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
権利情報	The full-text file will be made open to the public on 22 November 2025 in accordance with the publisher's policy.
出版タイプ	Accepted Manuscript
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCTERMS.bibliographicCitation	Measurement Science and Technology. 2024, 36, p. 015605
DC.title	Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique
DC.creator	Mori, Naoki
	Hakkaku, Toru
	Hayashi, Takahiro
DC.publisher	IOP Publishing
DC.language' scheme='DCTERMS.RFC1766	英語
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2024-11-22
DC.identifier	https://doi.org/10.1088/1361-6501/ad8f51
DC.subject	Adhesive curing
	Ultrasonic wave
	Layer resonance
	Spectral analysis
	Viscoelasticity
DC.description	This is the Accepted Manuscript version of an article accepted for publication in Measurement Science and Technology. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6501/ad8f51.
DCTERMS.abstract	Layer resonance induced by ultrasonic wave incidence is applied to monitor the viscoelastic properties of a curing adhesive layer between metal plates. A theoretical analysis shows that when the adhesive layer is modeled as a linear viscoelastic material, the ultrasonic reflection spectrum takes local minima at the layer resonance frequencies depending on the wave velocity of the adhesive. In contrast, the local minima of the reflection spectrum can be expressed as a function of the loss factor of the adhesive. Based on these results, a characterization technique for the wave velocity and the loss factor of a curing adhesive layer is proposed. This technique enables the evaluation of viscoelastic properties even if the reflected waves from both faces of a bond layer cannot be separated. The proposed method is used to investigate the curing behavior of bi-component epoxy adhesives. It is shown that the bonding condition affects the variation of the wave velocity and loss factor. The estimated wave velocity increases as the curing proceeds, whereas the loss factor sometimes takes a local maximum depending on the bonding condition and the frequency range. When the mixing ratio of the main and curing agents is imbalanced, the variation of the wave velocity becomes gradual. Furthermore, the increase in the curing temperature leads to fast changes in the wave velocity and loss factor. The proposed technique has the potential to provide insights into the curing behavior of the adhesive layer by incorporating it into other measurement methods and theories.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.rights	The full-text file will be made open to the public on 22 November 2025 in accordance with the publisher's policy.
DC.format	98532
citation_title	Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique
citation_author	Mori, Naoki
	Hakkaku, Toru
	Hayashi, Takahiro
citation_publisher	IOP Publishing
citation_language	英語
citation_date	2024-11-22
citation_journal_title	Measurement Science and Technology
citation_volume	36
citation_firstpage	015605
citation_doi	https://doi.org/10.1088/1361-6501/ad8f51
citation_public_url	https://hdl.handle.net/11094/98532

Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique

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