Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Huo, Fupeng; Chen, Chuantong; Zhang, Zheng; Zhang, Yicheng; Suetake, Aiji; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Zhang, Keke; Suganuma, Katsuaki

doi:https://doi.org/10.1016/j.jmrt.2024.07.071

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Huo, Fupeng; Chen, Chuantong; Zhang, Zheng et al.

Journal of Materials Research and Technology, 2024, 31, 3591-3603

アクセス数:798件（2025-07-27 20:54 集計）

固定URL: https://hdl.handle.net/11094/98541

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タイトル	Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
著者	著者名 Huo, Fupeng
	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 著者名 Chen, Chuantong
	NRID 1000010889314 1000010889314 ORCID 0000-0002-4201-3120 0000-0002-4201-3120 researchmap permalink 061516 061516 Scopus Author ID 57202582942 57202582942 著者名 Zhang, Zheng
	著者名 Zhang, Yicheng
	著者名 Suetake, Aiji
	著者名 Takeshita, Kazutaka
	著者名 Yamaguchi, Yoshiji
	著者名 Momose, Yashima
	著者名 Zhang, Keke
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma 著者名 Suganuma, Katsuaki
キーワード等	Graphene
	Mechanical properties
	Microstructure
	SnAgCu
	Surface metallization
	Wettability
内容	Huo F., Chen C., Zhang Z., et al. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties. Journal of Materials Research and Technology 31, 3591 (2024); https://doi.org/10.1016/j.jmrt.2024.07.071.
抄録	Based on the principles of micro-alloying and composite, the graphene reinforced Sn2.5Ag0.7Cu0.1Ce composite solder was designed. Ni nanoparticle-modified reduced graphene oxide (Ni-rGO) was prepared by thermal decomposition method, and the powder-melting method was proposed for the first time to prepare Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder. The microstructure, wettability, electrical resistivity, and mechanical properties of the composite solder were systematically studied. Results indicated that the Ni nanoparticles uniformly adhered to the rGO with a size of 26.3 nm. The effective incorporation of Ni-rGO into the solder matrix was achieved. The result broke the technical difficulty that graphene cannot be effectively added to low melting point metals. With the addition of Ni-rGO, the grain size gradually decreased, and the eutectic structures increased. Deep etching results revealed that columnar β-Sn was stacked from layered β-Sn, the addition of 0.05 wt% Ni-rGO led to an increase in sheet-like Ag3Sn within the eutectics. Additionally, Ni-rGO was found at the grain boundaries of composite solder, serving as nucleation sites for Ag3Sn and Cu6Sn5. At an addition of 0.05 wt%, the tensile strength reaches a maximum of 58.1 MPa, with elongation of 33.8%, surpassing the strength of commercial Sn3.0Ag0.5Cu solder. Therefore, the high-strength and tough composite solder was obtained. This study offered a new approach for the development of low-melting-point composite materials.
出版者	Elsevier Editora Ltda
収録物名	Journal of Materials Research and Technology
巻(号)	31
ページ	3591-3603
刊行年月	2024-07-01
言語	英語
ハンドルURL	https://hdl.handle.net/11094/98541
PISSN	22387854
関連情報 (isIdenticalTo)	DOI (出版社版) https://doi.org/10.1016/j.jmrt.2024.07.071
アクセス権	open access
権利情報	This article is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
出版タイプ	Version of Record
カテゴリ	学術雑誌論文 Journal Article

資源タイプ	学術雑誌論文
ローカル資源タイプ	学術雑誌論文
DCTERMS.bibliographicCitation	Journal of Materials Research and Technology. 2024, 31, p. 3591-3603
DC.title	Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
DC.creator	Huo, Fupeng
	Chen, Chuantong
	Zhang, Zheng
	Zhang, Yicheng
	Suetake, Aiji
	Takeshita, Kazutaka
	Yamaguchi, Yoshiji
	Momose, Yashima
	Zhang, Keke
	Suganuma, Katsuaki
DC.publisher	Elsevier Editora Ltda
DC.language' scheme='DCTERMS.RFC1766	英語
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2024-07-01
DC.identifier	https://doi.org/10.1016/j.jmrt.2024.07.071
DC.subject	Graphene
	Mechanical properties
	Microstructure
	SnAgCu
	Surface metallization
	Wettability
DC.description	Huo F., Chen C., Zhang Z., et al. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties. Journal of Materials Research and Technology 31, 3591 (2024); https://doi.org/10.1016/j.jmrt.2024.07.071.
DCTERMS.abstract	Based on the principles of micro-alloying and composite, the graphene reinforced Sn2.5Ag0.7Cu0.1Ce composite solder was designed. Ni nanoparticle-modified reduced graphene oxide (Ni-rGO) was prepared by thermal decomposition method, and the powder-melting method was proposed for the first time to prepare Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder. The microstructure, wettability, electrical resistivity, and mechanical properties of the composite solder were systematically studied. Results indicated that the Ni nanoparticles uniformly adhered to the rGO with a size of 26.3 nm. The effective incorporation of Ni-rGO into the solder matrix was achieved. The result broke the technical difficulty that graphene cannot be effectively added to low melting point metals. With the addition of Ni-rGO, the grain size gradually decreased, and the eutectic structures increased. Deep etching results revealed that columnar β-Sn was stacked from layered β-Sn, the addition of 0.05 wt% Ni-rGO led to an increase in sheet-like Ag3Sn within the eutectics. Additionally, Ni-rGO was found at the grain boundaries of composite solder, serving as nucleation sites for Ag3Sn and Cu6Sn5. At an addition of 0.05 wt%, the tensile strength reaches a maximum of 58.1 MPa, with elongation of 33.8%, surpassing the strength of commercial Sn3.0Ag0.5Cu solder. Therefore, the high-strength and tough composite solder was obtained. This study offered a new approach for the development of low-melting-point composite materials.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
DC.format	98541
citation_title	Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
citation_author	Huo, Fupeng
	Chen, Chuantong
	Zhang, Zheng
	Zhang, Yicheng
	Suetake, Aiji
	Takeshita, Kazutaka
	Yamaguchi, Yoshiji
	Momose, Yashima
	Zhang, Keke
	Suganuma, Katsuaki
citation_publisher	Elsevier Editora Ltda
citation_language	英語
citation_date	2024-07-01
citation_journal_title	Journal of Materials Research and Technology
citation_volume	31
citation_firstpage	3591
citation_lastpage	3603
citation_doi	https://doi.org/10.1016/j.jmrt.2024.07.071
citation_public_url	https://hdl.handle.net/11094/98541

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

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