学術雑誌論文

本学関連学会

text

電気材料技術雑誌. 2024, 33(1), p. 47-52

電気材料技術懇談会

日本語

text

2024-12-25

論文

In recent years, there has been a strong demand for electronic devices to be smaller, lighter, and more powerful. As a result, mounted components have become smaller, more powerful, and denser, and the heat generation density on printed circuit boards (PCBs) has increased. Since a rise in component temperature can lead to failure, efficient heat removal has become an urgent issue. Since general PCBs have low thermal conductivity, when high heat dissipation is required, methods to increase the thermal conductivity of PCBs have been employed by increasing the copper (Cu) content in the PCB or by placing an aluminum (Al) alloy in the inner layer. However, while Cu and Al have high thermal conductivity, they also have high coefficients of thermal expansion (CTE) and Young’s modulus, and the CTE of a PCB with increased thermal conductivity using these materials is high. If the thermal expansion difference between the PCB and mounted components is large, it can compromise the reliability against heat cycles. Thus, it is difficult to achieve both heat dissipation and low thermal expansion in current PCBs. Therefore, we have focused on copper-molybdenum (Cu-Mo) composite materials with high thermal conductivity, high elastic modulus, and low thermal expansion, and are developing PCBs using these materials. We have fabricated multilayer PCBs with an inner layer of Cu-Mo composite. We report on the thermal characterization of prototype PCBs.

10.18910/99608

99608

銅モリブデン複合材料を用いた高放熱低熱膨張基板の開発

電気材料技術懇談会

日本語

2024-12-25

電気材料技術雑誌

33

1

47

52

https://hdl.handle.net/11094/99608

10.18910/99608

https://doi.org/10.18910/99608