Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

Yamaoka, Kenji; Wada, Takuma; Ogasa, Iori; Komyo, Takeru; Luo, Chao; Ikura, Ryohei; Hino, Masahiro; Yamada, Masako; Seto, Hideki; Fujii, Yoshihisa; Uetsuji, Yasutomo; Takashima, Yoshinori

doi:https://doi.org/10.1002/adma.202507939

Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

Yamaoka, Kenji; Wada, Takuma; Ogasa, Iori et al.

Advanced Materials, 2025

Number of Access:22（2025-11-28 04:23 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/102960

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Title	Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion
Creator	NRID 1000020985254 1000020985254 ORCID 0000-0001-5655-1643 0000-0001-5655-1643 researchmap permalink yamaokak23 yamaokak23 Scopus Author ID 58687129700 58687129700 CreatorName Yamaoka, Kenji
	CreatorName Wada, Takuma
	CreatorName Ogasa, Iori
	CreatorName Komyo, Takeru
	CreatorName Luo, Chao
	CreatorName Ikura, Ryohei
	NRID 1000070314292 1000070314292 CreatorName Hino, Masahiro
	NRID 1000070708552 1000070708552 CreatorName Yamada, Masako
	NRID 1000060216546 1000060216546 CreatorName Seto, Hideki
	NRID 1000070578062 1000070578062 CreatorName Fujii, Yoshihisa
	NRID 1000000340604 1000000340604 CreatorName Uetsuji, Yasutomo
	NRID 1000040379277 1000040379277 ORCID 0000-0002-2620-3266 0000-0002-2620-3266 researchmap permalink ytakashima_0068747 ytakashima_0068747 Scopus Author ID 7103176267 7103176267 CreatorName Takashima, Yoshinori
Description	Yamaoka Kenji, Wada Takuma, Ogasa Iori, et al. Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion. Advanced Materials (2025); https://doi.org/10.1002/adma.202507939.
Abstract	Controllable adhesion that enables both reuse and dismantling is a key requirement for sustainable materials and device integration. Here,a polymeric adhesion system is demonstrated based on reversible interactions at the interface, in which the association and dissociation of supramolecular complexes are externally regulated by thermal and chemical stimuli. By tuning the glass transition temperature (Tg) of the polymers, chain mobility and complex reformation are simultaneously optimized, leading to enhanced interdiffusion and bond recombination at the adhesion interface. Neutron reflectivity (NR) measurements with deuterium labeling revealed that the interfacial width increased with annealing temperature, reaching up to 24.4 nm at 200 °C after 24 hours. The presence of reversible bonds suppressed polymer interdiffusion despite promoting adhesion strength. The resulting materials exhibit excellent reusability and dismantlability under mild stimuli, with strong potential for applications in recyclable electronics, automotive manufacturing, and temporary assembly technologies.
Publisher	Wiley
Source Title	Advanced Materials
Date of Issued	2025-10-03
Language	English
Handle URL	https://hdl.handle.net/11094/102960
PISSN	09359648
eISSN	15214095
Relation.isIdenticalTo	DOI (Publisher Version) https://doi.org/10.1002/adma.202507939
Access Rights	open access
CopyRight	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
oaire:version	Version of Record
Category	学術雑誌論文 Journal Article

Resource Type	journal article
Local Type	Journal Article
DCMI Type	Text
DCTERMS.bibliographicCitation	Advanced Materials. 2025
DC.title	Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion
DC.creator	Yamaoka, Kenji
	Wada, Takuma
	Ogasa, Iori
	Komyo, Takeru
	Luo, Chao
	Ikura, Ryohei
	Hino, Masahiro
	Yamada, Masako
	Seto, Hideki
	Fujii, Yoshihisa
	Uetsuji, Yasutomo
	Takashima, Yoshinori
DC.publisher	Wiley
DC.language' scheme='DCTERMS.RFC1766	English
DC.type' scheme='DCTERMS.DCMIType	Text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2025-10-03
DC.identifier	https://doi.org/10.1002/adma.202507939
DC.description	Yamaoka Kenji, Wada Takuma, Ogasa Iori, et al. Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion. Advanced Materials (2025); https://doi.org/10.1002/adma.202507939.
DCTERMS.abstract	Controllable adhesion that enables both reuse and dismantling is a key requirement for sustainable materials and device integration. Here,a polymeric adhesion system is demonstrated based on reversible interactions at the interface, in which the association and dissociation of supramolecular complexes are externally regulated by thermal and chemical stimuli. By tuning the glass transition temperature (Tg) of the polymers, chain mobility and complex reformation are simultaneously optimized, leading to enhanced interdiffusion and bond recombination at the adhesion interface. Neutron reflectivity (NR) measurements with deuterium labeling revealed that the interfacial width increased with annealing temperature, reaching up to 24.4 nm at 200 °C after 24 hours. The presence of reversible bonds suppressed polymer interdiffusion despite promoting adhesion strength. The resulting materials exhibit excellent reusability and dismantlability under mild stimuli, with strong potential for applications in recyclable electronics, automotive manufacturing, and temporary assembly technologies.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.format	102960
citation_title	Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion
citation_author	Yamaoka, Kenji
	Wada, Takuma
	Ogasa, Iori
	Komyo, Takeru
	Luo, Chao
	Ikura, Ryohei
	Hino, Masahiro
	Yamada, Masako
	Seto, Hideki
	Fujii, Yoshihisa
	Uetsuji, Yasutomo
	Takashima, Yoshinori
citation_publisher	Wiley
citation_language	English
citation_date	2025-10-03
citation_journal_title	Advanced Materials
citation_doi	https://doi.org/10.1002/adma.202507939
citation_public_url	https://hdl.handle.net/11094/102960

Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

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