The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives

Ho, Li-Ngee Ho; Nishikawa, Hiroshi; Natsume, Naohide et al.

Transactions of JWRI, 2008, 37(2), 69-73

Number of Access:310（2025-06-08 13:50 Counts）

Identifier to cite or link to this item: https://doi.org/10.18910/10631

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Title
The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives
Creator
CreatorName
Ho, Li-Ngee Ho
NRID
1000090346180 1000090346180
ORCID
0000-0002-4363-9520 0000-0002-4363-9520
researchmap permalink
read0191232 read0191232
Scopus Author ID
57219209494 57219209494
CreatorName
Nishikawa, Hiroshi
CreatorName
Natsume, Naohide
NRID
1000060093431 1000060093431
CreatorName
Takemoto, Tadashi
Subject
conductive adhesive
copper filler
trace element
oxidation resistance
Abstract
The properties of electrically conductive adhesives filled with copper fillers containing trace elements such as Ag, Ge, Mg and Zn were investigated in terms of electrical conductivity and thermal stability. The metallic fillers were characterized by using particle size analysis and scanning electron microscopy. Oxidation of metallic fillers under high temperature exposure led to degradation of electrical conductivity in the conductive adhesives. The addition of Ag and Mg in the copper fillers had significant effects on the electrical conductivity and thermal stability in the electrically conductive adhesives.
Publisher
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
Source Title
Transactions of JWRI
Volume (Issue)
37(2)
Page
69-73
Date of Issued
2008-12
Language
English
Handle URL
https://hdl.handle.net/11094/10631
DOI
https://doi.org/10.18910/10631
PISSN
03874508
NCID
AA00867058
Access Rights
open access
oaire:version
Version of Record
Category
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.37 No.2 (2008-12)