Identifier to cite or link to this item: https://doi.org/10.18910/11883

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Title	Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating
Creator	CreatorName Daito, Tomoya
	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 CreatorName Nishikawa, Hiroshi
	NRID 1000060093431 1000060093431 CreatorName Takemoto, Tadashi
	CreatorName Matsunami, Takashi
Subject	Lead-free solder
	Intermetallic compound
	Reaction layer
	Under bump metallurgy
	Co-P plating
	Ni-Co-P plating
Publisher	大阪大学接合科学研究所
	オオサカ ダイガク セツゴウ カガク ケンキュウジョ
	Joining and Welding Research Institute, Osaka University
Source Title	Transactions of JWRI
Volume (Issue)	39(2)
Page	224-225
Date of Issued	2010-12
Language	English
Handle URL	https://hdl.handle.net/11094/11883
DOI	https://doi.org/10.18910/11883
PISSN	03874508
NCID	AA00867058
Access Rights	open access
oaire:version	Version of Record
Category	紀要論文 Departmental Bulletin Paper
	Transactions of JWRI / Vol.39 No.2 (2010-12)

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