Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints

Gao, Feng; Nishikawa, Hiroshi; Takemoto, Tadashi

doi:https://doi.org/10.18910/12170

Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints

Gao, Feng; Nishikawa, Hiroshi; Takemoto, Tadashi

Transactions of JWRI, 2005, 34(2), 57-61

Number of Access:615（2025-08-29 07:56 Counts）

Identifier to cite or link to this item: https://doi.org/10.18910/12170

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Title	Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
Creator	CreatorName Gao, Feng
	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 CreatorName Nishikawa, Hiroshi
	NRID 1000060093431 1000060093431 CreatorName Takemoto, Tadashi
Subject	Lead-free solder
	Intermetallic compounds
	Morphology
	Additive
Abstract	The microstructures of intermetallic compounds at the interface and dispersed in the solder matrix were characterized in this paper. Two sorts of solders, Sn3.5Ag and Sn3.5Ag0.3Co were selected to examine the interfacial reaction with the Cu substrate. In the Sn3.5Ag0.3Co solder matrix, the ternary Sn-Cu-Co IMC was detected, which indicated that the additives exhibit high affinity with the Sn atoms. The IMC composition on the solder side is almost the same as the ones distributed within the solder matrix, which means that the formation of IMC at this side is related closely to the solder microstructure. On the other hand, much lower additive concentrations were observed on the Cu side (or Cu₃Sn phase after aging). The non-homogeneous characteristic of IMC was suggested owing to the non-uniform concentration distribution of additives, that is, the IMCs morphology at the interface seemed quite different. The faceted and elongated shape was observed at the solder side, while the nearly rounded shape seen at the Cu side.
Publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
Source Title	Transactions of JWRI
Volume (Issue)	34(2)
Page	57-61
Date of Issued	2005-12
Language	English
Handle URL	https://hdl.handle.net/11094/12170
DOI	https://doi.org/10.18910/12170
PISSN	03874508
NCID	AA00867058
Access Rights	open access
oaire:version	Version of Record
Category	紀要論文 Departmental Bulletin Paper
Category	Transactions of JWRI / Vol.34 No.2 (2005-12)

Resource Type	departmental bulletin paper
Local Type	Departmental Bulletin Paper
DCMI Type	Text
DCTERMS.bibliographicCitation	Transactions of JWRI. 2005, 34(2), p. 57-61
DC.title	Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
DC.creator	Gao, Feng
	Nishikawa, Hiroshi
	Takemoto, Tadashi
DC.publisher	大阪大学接合科学研究所
	オオサカダイガクセツゴウカガクケンキュウジョ
	Joining and Welding Research Institute, Osaka University
DC.language' scheme='DCTERMS.RFC1766	English
DC.type' scheme='DCTERMS.DCMIType	Text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2005-12
DC.subject	Lead-free solder
	Intermetallic compounds
	Morphology
	Additive
DCTERMS.abstract	The microstructures of intermetallic compounds at the interface and dispersed in the solder matrix were characterized in this paper. Two sorts of solders, Sn3.5Ag and Sn3.5Ag0.3Co were selected to examine the interfacial reaction with the Cu substrate. In the Sn3.5Ag0.3Co solder matrix, the ternary Sn-Cu-Co IMC was detected, which indicated that the additives exhibit high affinity with the Sn atoms. The IMC composition on the solder side is almost the same as the ones distributed within the solder matrix, which means that the formation of IMC at this side is related closely to the solder microstructure. On the other hand, much lower additive concentrations were observed on the Cu side (or Cu₃Sn phase after aging). The non-homogeneous characteristic of IMC was suggested owing to the non-uniform concentration distribution of additives, that is, the IMCs morphology at the interface seemed quite different. The faceted and elongated shape was observed at the solder side, while the nearly rounded shape seen at the Cu side.
DC.identifier	10.18910/12170
DC.format	12170
citation_title	Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
citation_author	Gao, Feng
	Nishikawa, Hiroshi
	Takemoto, Tadashi
citation_publisher	大阪大学接合科学研究所
citation_language	English
citation_date	2005-12
citation_journal_title	Transactions of JWRI
citation_volume	34
citation_issue	2
citation_firstpage	57
citation_lastpage	61
citation_public_url	https://hdl.handle.net/11094/12170
citation_doi_detail	10.18910/12170
citation_doi	https://doi.org/10.18910/12170

Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints

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