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Title	Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate
Creator	NRID 1000000210253 1000000210253 ORCID 0000-0003-4998-1316 0000-0003-4998-1316 researchmap permalink kiyoyasuda kiyoyasuda Scopus Author ID 7403377969 7403377969 CreatorName Yasuda, Kiyokazu
	NRID 1000080273712 1000080273712 CreatorName Sakino, Yoshihiro
	NRID 1000000323329 1000000323329 CreatorName Shoji, Ikuo
	NRID 1000060093431 1000060093431 CreatorName Takemoto, Tadashi
Subject	Lead-free solder
	Tensile test
	Strain rate sensitivity
	High strain rate
	Sn-Ag-Cu
	Ductility
	Rupture
	Stress-strain curve
	Tensile strength
	Yielding point
Publisher	大阪大学接合科学研究所
	オオサカ ダイガク セツゴウ カガク ケンキュウジョ
	Joining and Welding Research Institute, Osaka University
Source Title	Transactions of JWRI
Volume (Issue)	39(2)
Page	360-361
Date of Issued	2010-12
Language	English
Handle URL	https://hdl.handle.net/11094/24824
DOI	https://doi.org/10.18910/24824
PISSN	03874508
NCID	AA00867058
Access Rights	open access
oaire:version	Version of Record
Category	紀要論文 Departmental Bulletin Paper
	Transactions of JWRI / Vol.39 No.2 (2010-12)

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