固体基板上における金ナノ粒子の溶融温度に及ぼす基板の影響に関する熱力学的考察

李, 俊昊; 田中, 敏宏; 李, 正九 他

日本金属学会秋期大会講演概要(2004), 2004, 380-380

Number of Access:3842025-09-03 10:54 Counts

Identifier to cite or link to this item: https://hdl.handle.net/11094/26219

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AJIM135_380 pdf None 72.2 KB 260 2013.10.28  

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