固体銅に対する液体Biの特異拡張濡れ現象とその接合への応用

高平, 信幸; 吉川, 健; 田中, 敏宏

2008, 37-40

Number of Access:754（2025-09-03 08:33 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/26588

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Title
固体銅に対する液体Biの特異拡張濡れ現象とその接合への応用
Unusual Wetting Phenomenon of Liquid Bi on Solid Cu and Its Application to Joining
コタイドウ　ニ　タイスル　エキタイ　Bi　ノ　トクイ　カクチョウ　ヌレ　ゲンショウ　ト　ソノ　セツゴウ　ヘノ　オウヨウ
Creator
CreatorName
高平, 信幸 ; タカヒラ, ノブユキ ; Takahira, Nobuyuki
NRID
1000090435933 1000090435933
CreatorName
吉川, 健 ; ヨシカワ, タケシ ; Yoshikawa, Takeshi
NRID
1000010179773 1000010179773
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CreatorName
田中, 敏宏 ; タナカ, トシヒロ ; Tanaka, Toshihiro
Subject
wettability
porous structure
capillary phenomenon
bismuth
copper
joining
Abstract
An unusual wetting phenomenon of liquid Bi on a surface-porous copper has been studied. A surface-oxidized copper substrate was reduced at 473K in H_2 to prepare a porous metallic layer at the surface, and the wetting behavior of liquid Bi on this metallic layer was investigated. The unusual wetting behavior of liquid Bi was observed on the surface-porous copper substrate. This unusual wetting phenomenon of liquid Bi was then applied in the joining of copper wire with the surface-porous copper substrate. Bonding was successfully achieved with a minimized weld overlay at the joining point.
Publisher
溶接学会
ヨウセツ　ガッカイ
Page
37-40
Date of Issued
2008-02-05
Language
Japanese
Handle URL
https://hdl.handle.net/11094/26588
Relation.isPartOf
ISBN
9784906110131
NCID
BB0936411X
Access Rights
open access
oaire:version
Version of Record
Category
会議発表論文 Conference Paper