Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding

Maeda, Masakatsu; Takahashi, Yasuo

Transactions of JWRI, 2013, 42(2), 15-20

Number of Access:274（2025-09-15 06:53 Counts）

Identifier to cite or link to this item: https://doi.org/10.18910/27403

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Title
Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
Creator
NRID
1000000263327 1000000263327
CreatorName
Maeda, Masakatsu
NRID
1000080144434 1000080144434
CreatorName
Takahashi, Yasuo
Subject
High-speed process monitoring
Deformation of wiring material
Expansion of adhered area
Ultrasonic wedge bonding
Power electronic devices
Abstract
Thick Al wires were welded with Al-Si, Si and SiO_2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.
Publisher
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
Source Title
Transactions of JWRI
Volume (Issue)
42(2)
Page
15-20
Date of Issued
2013-12
Language
English
Handle URL
https://hdl.handle.net/11094/27403
DOI
https://doi.org/10.18910/27403
PISSN
03874508
NCID
AA00867058
Access Rights
open access
oaire:version
Version of Record
Category
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.42 No.2 (2013-12)