Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder

Mokhtari, Omid; Nishikawa, Hiroshi

Transactions of JWRI, 2015, 44(2), 19-22

Number of Access:358（2025-06-12 18:31 Counts）

Identifier to cite or link to this item: https://doi.org/10.18910/57271

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Title
Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder
Creator
CreatorName
Mokhtari, Omid
NRID
1000090346180 1000090346180
ORCID
0000-0002-4363-9520 0000-0002-4363-9520
researchmap permalink
read0191232 read0191232
Scopus Author ID
57219209494 57219209494
CreatorName
Nishikawa, Hiroshi
Abstract
A comparative analysis between the microstructure and the tensile properties of eutectic Sn-Bi,(Sn-Bi)-0.5In,and (Sn-Bi)-1In solder alloys was conducted. Tensile tests were performed on bulk solder alloys, followed by post-test fracture surface analysis. The results of the tensile tests indicated that the addition of In is highly effective in improving the ductility of the SN-Bi solder alloys. Moreover, on increasing the In content from 0.5 to 1wt.%, the elongation of the Sn-Bi solder alloy exhibited a significant increase. In addition, the dimple-like structure on the fracture surfaces of the tensile tested In-bearing solder alloys indicated the ductile properties of the alloys.
Publisher
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
Source Title
Transactions of JWRI
Volume (Issue)
44(2)
Page
19-22
Date of Issued
2015-12
Language
English
Handle URL
https://hdl.handle.net/11094/57271
DOI
https://doi.org/10.18910/57271
PISSN
03874508
NCID
AA00867058
Access Rights
open access
oaire:version
Version of Record
Category
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.44 No.2 (2015-12)