Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

Cheng, Fangjie; Nishikawa, Hiroshi; Takemoto, Tadashi

Transactions of JWRI, 2007, 36(1), 53-56

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Identifier to cite or link to this item: https://doi.org/10.18910/7653

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Title
Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
Creator
CreatorName
Cheng, Fangjie
NRID
1000090346180 1000090346180
ORCID
0000-0002-4363-9520 0000-0002-4363-9520
researchmap permalink
read0191232 read0191232
Scopus Author ID
57219209494 57219209494
CreatorName
Nishikawa, Hiroshi
NRID
1000060093431 1000060093431
CreatorName
Takemoto, Tadashi
Subject
Lead-free solder
Isothermal aging
Minor element addition
Microstructure
Tensile behavior
Abstract
The effects of Co addition on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu lead-free solder were explored. The addition of Co resulted in the formation of CoSn₂ intermetallic compounds (IMCs). The amount of Co has a notable effect on the morphology of CoSn₂ IMCs. The CoSn₂ phases presented needle shapes with 0.2mass% Co addition, however it presented block shapes with 0.5mass% Co addition. Similar to the SAC baseline, after high temperature aging, the microstructure of Co-containing solders became notably coarsened. During aging, the Cu₆Sn₅ IMCs tended to grow around the CoSn2 phases. In the cast condition, the addition of small amounts of Co had little effect on the tensile strength of SAC-based solder alloys, although it notably suppressed the ductility. After aging, the Co-containing SAC solders showed two trends, one was the decrease of ultimate tensile strength, the other was the increase of ductility. Small additions of Co worsened the ductility of SAC-Co solder alloy, however the high temperature aging suppressed this negative effect.
Publisher
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
Source Title
Transactions of JWRI
Volume (Issue)
36(1)
Page
53-56
Date of Issued
2007-07
Language
English
Handle URL
https://hdl.handle.net/11094/7653
DOI
https://doi.org/10.18910/7653
PISSN
03874508
NCID
AA00867058
Access Rights
open access
oaire:version
Version of Record
Category
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.36 No.1 (2007-07)