Real-Time acoustic emission monitoring of wear-out failure in sic power electronic devices during power cycling tests

Choe, Chanyang; Chen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki

doi:https://doi.org/10.1109/TPEL.2020.3024986

Real-Time acoustic emission monitoring of wear-out failure in sic power electronic devices during power cycling tests

Choe, Chanyang; Chen, Chuantong; Nagao, Shijo et al.

IEEE Transactions on Power Electronics, 2021, 36(4), 4420-4428

Number of Access:654（2025-10-27 11:43 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/78251

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Title	Real-Time acoustic emission monitoring of wear-out failure in sic power electronic devices during power cycling tests
Creator	CreatorName Choe, Chanyang
	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 CreatorName Chen, Chuantong
	CreatorName Nagao, Shijo
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma CreatorName Suganuma, Katsuaki
Subject	Acoustic emission (AE)
	Ag sinter joint
	Al ribbon
	failure
	monitoring
	Power cycling test (PCT)
Description	C. Choe, C. Chen, S. Nagao and K. Suganuma, "Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests," in IEEE Transactions on Power Electronics, vol. 36, no. 4, pp. 4420-4428, April 2021, doi: 10.1109/TPEL.2020.3024986.
Abstract	In the article, acoustic emission (AE) was applied to monitor the wear-out failure in discrete SiC Schottky barrier diodes devices with a Ag sinter die attach to successfully monitor the real-Time progress of failure of Al ribbons for the first time. After eliminating background AE noise including the power on-off switch and the ambient noise via a noise filtering process, AE signals were successfully collected for the SiC devices during a power cycling test. Furthermore, AE monitoring was compared to the traditional failure monitoring method using forward voltage. Physics-of-failure analysis was performed, and fatigue cracks, and lift-off in Al ribbons were confirmed as the dominant failure modes for the discrete devices. Specifically, AE counts that correspond to one of the time-domain parameters of AE signals increased with power cycling, thereby corresponding to the observed fatigue cracks in Al ribbons leading to lift-off failure. Additionally, the AE count rate was highly correlated with the crack growth rate. Based on the relationship between an AE count rate and fatigue crack growth rate, the results indicate that AE monitoring can be used to understand the fatigue propagation in Al ribbons (i.e., failure mechanism) and also as an early warning before catastrophic lift-off fracture for power electronic devices.
Publisher	Institute of Electrical and Electronics Engineers Inc.
Source Title	IEEE Transactions on Power Electronics
Volume (Issue)	36(4)
Page	4420-4428
Date of Issued	2021-04-01
Language	English
Handle URL	https://hdl.handle.net/11094/78251
PISSN	08858993
eISSN	19410107
Relation.isVersionOf	DOI (Publisher Version) https://doi.org/10.1109/TPEL.2020.3024986
Access Rights	open access
CopyRight	© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
oaire:version	Accepted Manuscript
Category	学術雑誌論文 Journal Article

Resource Type	journal article
Local Type	Journal Article
DCMI Type	Text
DCTERMS.bibliographicCitation	IEEE Transactions on Power Electronics. 2021, 36(4), p. 4420-4428
DC.title	Real-Time acoustic emission monitoring of wear-out failure in sic power electronic devices during power cycling tests
DC.creator	Choe, Chanyang
	Chen, Chuantong
	Nagao, Shijo
	Suganuma, Katsuaki
DC.publisher	Institute of Electrical and Electronics Engineers Inc.
DC.language' scheme='DCTERMS.RFC1766	English
DC.type' scheme='DCTERMS.DCMIType	Text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2021-04-01
DC.identifier	https://doi.org/10.1109/TPEL.2020.3024986
DC.subject	Acoustic emission (AE)
	Ag sinter joint
	Al ribbon
	failure
	monitoring
	Power cycling test (PCT)
DC.description	C. Choe, C. Chen, S. Nagao and K. Suganuma, "Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests," in IEEE Transactions on Power Electronics, vol. 36, no. 4, pp. 4420-4428, April 2021, doi: 10.1109/TPEL.2020.3024986.
DCTERMS.abstract	In the article, acoustic emission (AE) was applied to monitor the wear-out failure in discrete SiC Schottky barrier diodes devices with a Ag sinter die attach to successfully monitor the real-Time progress of failure of Al ribbons for the first time. After eliminating background AE noise including the power on-off switch and the ambient noise via a noise filtering process, AE signals were successfully collected for the SiC devices during a power cycling test. Furthermore, AE monitoring was compared to the traditional failure monitoring method using forward voltage. Physics-of-failure analysis was performed, and fatigue cracks, and lift-off in Al ribbons were confirmed as the dominant failure modes for the discrete devices. Specifically, AE counts that correspond to one of the time-domain parameters of AE signals increased with power cycling, thereby corresponding to the observed fatigue cracks in Al ribbons leading to lift-off failure. Additionally, the AE count rate was highly correlated with the crack growth rate. Based on the relationship between an AE count rate and fatigue crack growth rate, the results indicate that AE monitoring can be used to understand the fatigue propagation in Al ribbons (i.e., failure mechanism) and also as an early warning before catastrophic lift-off fracture for power electronic devices.
DC.rights	© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
DC.format	78251
citation_title	Real-Time acoustic emission monitoring of wear-out failure in sic power electronic devices during power cycling tests
citation_author	Choe, Chanyang
	Chen, Chuantong
	Nagao, Shijo
	Suganuma, Katsuaki
citation_publisher	Institute of Electrical and Electronics Engineers Inc.
citation_language	English
citation_date	2021-04-01
citation_journal_title	IEEE Transactions on Power Electronics
citation_volume	36
citation_issue	4
citation_firstpage	4420
citation_lastpage	4428
citation_doi	https://doi.org/10.1109/TPEL.2020.3024986
citation_public_url	https://hdl.handle.net/11094/78251

Real-Time acoustic emission monitoring of wear-out failure in sic power electronic devices during power cycling tests

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