Simulations of trench-filling profiles under ionized magnetron sputter metal deposition

Hamaguchi, S.; Rossnagel, S. M.

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 1995, 13(2), 183-191

Number of Access:3952025-08-28 19:29 Counts

Identifier to cite or link to this item: https://hdl.handle.net/11094/78503

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