Effect of Halogenation Treatment to Solder on Anodic Soldering

Takahashi, Makoto; Ikeuchi, Kenji

Transactions of JWRI, 2008, 37(1), 39-43

Number of Access:246（2025-06-07 18:16 Counts）

Identifier to cite or link to this item: https://doi.org/10.18910/8309

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Title
Effect of Halogenation Treatment to Solder on Anodic Soldering
Creator
NRID
1000010294133 1000010294133
researchmap permalink
AB_MTakahashi AB_MTakahashi
Scopus Author ID
55701142600 55701142600
CreatorName
Takahashi, Makoto
NRID
1000010030058 1000010030058
CreatorName
Ikeuchi, Kenji
Subject
soldering
anodic bonding
oxide layer
halogenation treatment
leadfree solder
borosilicate glass
Abstract
The effect of the halogenation treatment of tin based solder on the wettability of tin based solder to glass was examined, and that treatment was applied to anodic soldering - soldering of glass utilizing the principle of anodic bonding. The halogenation treatment by hydrogen chloride vapor considerably improves wettability of pure tin solder and Sn-3.5mass%Ag solder to glass. In anodic soldering, the halogenation treatment improves the spread of solder at the joint interface. In anodic soldering using pure tin solder receiving the halogenation treatment, application of voltage improved the strength of produced joints. But too long application of voltage was harmful to soundness of the joints. This was thought to be caused by excess growth of the oxide layer at the joint interface. In soldering using Sn-3.5mass%Ag solder, the effect of the voltage application was not clear.
Publisher
大阪大学接合科学研究所
オオサカ ダイガク セツゴウ カガク ケンキュウジョ
Joining and Welding Research Institute, Osaka University
Source Title
Transactions of JWRI
Volume (Issue)
37(1)
Page
39-43
Date of Issued
2008-07
Language
English
Handle URL
https://hdl.handle.net/11094/8309
DOI
https://doi.org/10.18910/8309
PISSN
03874508
NCID
AA00867058
Access Rights
open access
oaire:version
Version of Record
Category
紀要論文 Departmental Bulletin Paper
Transactions of JWRI / Vol.37 No.1 (2008-07)