Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy

Ogi, H.; Yamamoto, A.; Kondou, K.; Nakano, K.; Morita, K.; Nakamura, N.; Ono, T.; Hirao, M.

doi:https://doi.org/10.1103/PhysRevB.82.155436

Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy

Ogi, H.; Yamamoto, A.; Kondou, K. et al.

Physical Review B - Condensed Matter and Materials Physics, 2010, 82(15), 155436-1-155436-5

Number of Access:786（2025-11-25 02:20 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/84180

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Title	Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy
Creator	NRID 1000090252626 1000090252626 researchmap permalink read0042771 read0042771 Scopus Author ID 35563683500 35563683500 ORCID 0000-0002-9602-5194 0000-0002-9602-5194 CreatorName Ogi, H.
	CreatorName Yamamoto, A.
	CreatorName Kondou, K.
	CreatorName Nakano, K.
	CreatorName Morita, K.
	NRID 1000050452404 1000050452404 researchmap permalink nnakamura nnakamura Scopus Author ID 7403356186 7403356186 ORCID 0000-0002-5338-842X 0000-0002-5338-842X CreatorName Nakamura, N.
	NRID 1000090296749 1000090296749 CreatorName Ono, T.
	NRID 1000080112027 1000080112027 CreatorName Hirao, M.
Description	Ogi H., Yamamoto A., Kondou K., et al. "Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy", Physical Review B - Condensed Matter and Materials Physics, 82(15), 155436, 2010. https://doi.org/10.1103/PhysRevB.82.155436.
Abstract	High-frequency vibrations related with copper nanowires on a silicon substrate are studied using picosecond ultrasound spectroscopy. The reflectivity change in the probe light pulse is monitored after irradiation of the specimen with the ultrafast light pulse, showing high (∼75 GHz) and low (<∼15 GHz) frequency vibrations, which are identified to be thickness resonance of nanowires and collective-mode resonances on the substrate, respectively. The nanowires are subjected to the current-loading test to induce electromigration. The thickness resonance frequency significantly decreases as the progress of the electromigration while the other frequencies and the resistance remain nearly unchanged. The micromechanics analysis and the vacancy diffusion theory indicate the growth of thin defects at grain boundaries for softening the nanowires. © 2010 The American Physical Society.
Publisher	American Physical Society
Source Title	Physical Review B - Condensed Matter and Materials Physics
Volume (Issue)	82(15)
Page	155436-1-155436-5
Date of Issued	2010-10-19
Language	English
Handle URL	https://hdl.handle.net/11094/84180
PISSN	10980121
eISSN	1550235X
NCID	AA11187113
Relation.isIdenticalTo	DOI (Publisher Version) https://doi.org/10.1103/PhysRevB.82.155436
Access Rights	open access
CopyRight	Copyright 2010 by the American Physical Society
oaire:version	Version of Record
Category	学術雑誌論文 Journal Article

Resource Type	journal article
Local Type	Journal Article
DCMI Type	Text
DCTERMS.bibliographicCitation	Physical Review B - Condensed Matter and Materials Physics. 2010, 82(15), p. 155436-1-155436-5
DC.title	Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy
DC.creator	Ogi, H.
	Yamamoto, A.
	Kondou, K.
	Nakano, K.
	Morita, K.
	Nakamura, N.
	Ono, T.
	Hirao, M.
DC.publisher	American Physical Society
DC.language' scheme='DCTERMS.RFC1766	English
DC.type' scheme='DCTERMS.DCMIType	Text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2010-10-19
DC.identifier	https://doi.org/10.1103/PhysRevB.82.155436
DC.description	Ogi H., Yamamoto A., Kondou K., et al. "Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy", Physical Review B - Condensed Matter and Materials Physics, 82(15), 155436, 2010. https://doi.org/10.1103/PhysRevB.82.155436.
DCTERMS.abstract	High-frequency vibrations related with copper nanowires on a silicon substrate are studied using picosecond ultrasound spectroscopy. The reflectivity change in the probe light pulse is monitored after irradiation of the specimen with the ultrafast light pulse, showing high (∼75 GHz) and low (<∼15 GHz) frequency vibrations, which are identified to be thickness resonance of nanowires and collective-mode resonances on the substrate, respectively. The nanowires are subjected to the current-loading test to induce electromigration. The thickness resonance frequency significantly decreases as the progress of the electromigration while the other frequencies and the resistance remain nearly unchanged. The micromechanics analysis and the vacancy diffusion theory indicate the growth of thin defects at grain boundaries for softening the nanowires. © 2010 The American Physical Society.
DC.rights	Copyright 2010 by the American Physical Society
DC.format	84180
citation_title	Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy
citation_author	Ogi, H.
	Yamamoto, A.
	Kondou, K.
	Nakano, K.
	Morita, K.
	Nakamura, N.
	Ono, T.
	Hirao, M.
citation_publisher	American Physical Society
citation_language	English
citation_date	2010-10-19
citation_journal_title	Physical Review B - Condensed Matter and Materials Physics
citation_volume	82
citation_issue	15
citation_firstpage	155436-1
citation_lastpage	155436-5
citation_doi	https://doi.org/10.1103/PhysRevB.82.155436
citation_public_url	https://hdl.handle.net/11094/84180

Significant softening of copper nanowires during electromigration studied by picosecond ultrasound spectroscopy

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