Adhesive bond imaging by noncontact measurements with single-sided access

Nakao, Shogo; Hayashi, Takahiro

doi:https://doi.org/10.1115/1.4039229

Adhesive bond imaging by noncontact measurements with single-sided access

Nakao, Shogo; Hayashi, Takahiro

Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems, 2018, 1(2), 021009

Number of Access:259（2025-08-14 15:06 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/85208

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Title	Adhesive bond imaging by noncontact measurements with single-sided access
Creator	CreatorName Nakao, Shogo
Creator	NRID 1000030324479 1000030324479 ORCID 0000-0001-6064-4658 0000-0001-6064-4658 researchmap permalink takahiro_hayashi takahiro_hayashi Scopus Author ID 37064150200 37064150200 CreatorName Hayashi, Takahiro
Subject	Adhesives
	Imaging
	Plates(structures)
	Waves
	Flat plates
	Lasers
Abstract	Adhesive bonding, an effective joining technique for platelike structures in aircraft and automobiles, requires postbond inspection preferably with noncontact and single-sided access. The present study discusses the application of an imaging technique with a scanning laser source (SLS) to evaluate adhesive bonds in a platelike structure. When a laser Doppler vibrometer (LDV) is used as a receiver, the SLS technique realizes noncontact measurements with single-sided access. The imaging experiments that used narrowband burst waves and broadband chirp waves indicated that the imaging technique is appropriately applied to adhesive bonds and that the use of broadband chirp waves provides clearer images and reduces spurious images due to resonance. Furthermore, images of adhesive bonds were clearly obtained for a complex plate structure that consisted of a top-hat section and a flat plate, and this demonstrates that the imaging technique can be widely applied to evaluate various adhesive bonds.
Publisher	American Society of Mechanical Engineers (ASME)
Source Title	Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Volume (Issue)	1(2)
Page	021009
Date of Issued	2018-02-23
Language	English
Handle URL	https://hdl.handle.net/11094/85208
PISSN	25723901
eISSN	25723898
NCID	AA1281791X
Relation.isVersionOf	DOI (Publisher Version) https://doi.org/10.1115/1.4039229
Access Rights	open access
CopyRight	© 2018 ASME. This manuscript version is made available under the Creative Commons Attribution 4.0 International License.
oaire:version	Accepted Manuscript
Category	学術雑誌論文 Journal Article

Resource Type	journal article
Local Type	Journal Article
DCMI Type	Text
DCTERMS.bibliographicCitation	Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems. 2018, 1(2), p. 021009
DC.title	Adhesive bond imaging by noncontact measurements with single-sided access
DC.creator	Nakao, Shogo
DC.creator	Hayashi, Takahiro
DC.publisher	American Society of Mechanical Engineers (ASME)
DC.language' scheme='DCTERMS.RFC1766	English
DC.type' scheme='DCTERMS.DCMIType	Text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2018-02-23
DC.identifier	https://doi.org/10.1115/1.4039229
DC.subject	Adhesives
	Imaging
	Plates(structures)
	Waves
	Flat plates
	Lasers
DCTERMS.abstract	Adhesive bonding, an effective joining technique for platelike structures in aircraft and automobiles, requires postbond inspection preferably with noncontact and single-sided access. The present study discusses the application of an imaging technique with a scanning laser source (SLS) to evaluate adhesive bonds in a platelike structure. When a laser Doppler vibrometer (LDV) is used as a receiver, the SLS technique realizes noncontact measurements with single-sided access. The imaging experiments that used narrowband burst waves and broadband chirp waves indicated that the imaging technique is appropriately applied to adhesive bonds and that the use of broadband chirp waves provides clearer images and reduces spurious images due to resonance. Furthermore, images of adhesive bonds were clearly obtained for a complex plate structure that consisted of a top-hat section and a flat plate, and this demonstrates that the imaging technique can be widely applied to evaluate various adhesive bonds.
DC.rights	© 2018 ASME. This manuscript version is made available under the Creative Commons Attribution 4.0 International License.
DC.format	85208
citation_title	Adhesive bond imaging by noncontact measurements with single-sided access
citation_author	Nakao, Shogo
citation_author	Hayashi, Takahiro
citation_publisher	American Society of Mechanical Engineers (ASME)
citation_language	English
citation_date	2018-02-23
citation_journal_title	Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
citation_volume	1
citation_issue	2
citation_firstpage	021009
citation_doi	https://doi.org/10.1115/1.4039229
citation_public_url	https://hdl.handle.net/11094/85208

Adhesive bond imaging by noncontact measurements with single-sided access

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