EEM(Elastic Emission Machining)によるSi(001)表面の平坦化（第1報） : 半導体表面の超平坦化のための超清浄EEMシステムの開発

森, 勇藏; 山内, 和人; 三村, 秀和 他

精密工学会誌論文集, 2004, 70(3), 391-396

Number of Access:778（2025-08-16 04:13 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/86992

Link to primary information 

File Format Terms of use Size Views Date.Available Description information
JJpnSocPrecEng_70_3_391 pdf None 0.98 MB 114 2022.03.29  

Item Information

Output File Export EndNote Basic Export Mendeley

Title
EEM(Elastic Emission Machining)によるSi(001)表面の平坦化（第1報） : 半導体表面の超平坦化のための超清浄EEMシステムの開発
Flattening Si (001) surface by EEM (Elastic Emission Machining) : Development of Ultraclean EEM system for ultraflat semiconductor surface preparation
Creator
NRID
1000000029125 1000000029125
CreatorName
森, 勇藏
NRID
1000010174575 1000010174575
researchmap permalink
yamauchikazuto yamauchikazuto
Scopus Author ID
7801509680 7801509680
CreatorName
山内, 和人
NRID
1000030362651 1000030362651
CreatorName
三村, 秀和
NRID
1000050273579 1000050273579
researchmap permalink
read0185268 read0185268
Scopus Author ID
35513238700 35513238700
CreatorName
稲垣, 耕司
NRID
1000080404325 1000080404325
CreatorName
久保田, 章亀
NRID
1000090152008 1000090152008
researchmap permalink
endo5352 endo5352
Scopus Author ID
7402712908 7402712908
CreatorName
遠藤, 勝義
Subject
EEM
ultraprecision machining
atomic-level flatness
Si(001) surface
Hydrogen-terminated Si surface
AFM (Atomic Force Microscope)
STM (Scanning Tunneling Microscope)
Description
森 勇藏, 山内 和人, 三村 秀和, 稲垣 耕司, 久保田 章亀, 遠藤 勝義, EEM(Elastic Emission Machining)によるSi(001)表面の平坦化（第1報）, 精密工学会誌論文集, 2004, 70 巻, 3 号, p. 391-396, https://doi.org/10.2493/jspe.70.391.
Abstract
Ultraprecision surface preparation techniques to make atomically flat Si surfaces are strongly demanded in the next-generation semiconductor technology age. However, effective technique dose not exist particularly for Si(001) surface smoothing. The only possible technique is a heating method in the ultra-high vacuum, however it dose not have industrial feasibility. In this work, a new EEM (Elastic Emission Machining) system having ultrahigh cleanliness has been developed for semiconductor surface preparation. In the EEM system, ultraclean techniques such as a refining system for mixture fluid and numerically controlled sample stages hydrostatically supported by ultrapure water are developed and equipped. Machined surfaces are observed by AFM (atomic force microscope). Obtained images show that topmost atoms on the premachined surfaces are preferentially removed in EEM, and that the processed surfaces have atomic-level flatness.
Publisher
精密工学会
Source Title
精密工学会誌論文集
Volume (Issue)
70(3)
Page
391-396
Date of Issued
2004-03-05
Language
Japanese
Handle URL
https://hdl.handle.net/11094/86992
PISSN
13488724
eISSN
18818722
NCID
AA11966630
AA12074837
Relation.isIdenticalTo
DOI (Publisher Version)
https://doi.org/10.2493/jspe.70.391
Access Rights
open access
oaire:version
Version of Record
Category
学術雑誌論文 Journal Article