Study of Cu Micro-via by TOF-SIMS and STEM

Nishijima, Masahiko; Hsieh, Ming Chun; Zheng, Zhang; Suetake, Aiji; Yoshida, Hiroshi; Okumuara, Rieko; Chen, Chuantong; Homma, Hidekazu; Kita, Koji; Suganuma, Katsuaki

doi:https://doi.org/10.23919/ICEP58572.2023.10129689

Study of Cu Micro-via by TOF-SIMS and STEM

Nishijima, Masahiko; Hsieh, Ming Chun; Zheng, Zhang et al.

2023 International Conference on Electronics Packaging, 2023, 151-152

Number of Access:928（2025-08-24 14:00 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/94634

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Title	Study of Cu Micro-via by TOF-SIMS and STEM
Creator	ORCID 0000-0002-5143-7558 0000-0002-5143-7558 researchmap permalink 7000005445 7000005445 Scopus Author ID 13608349900 13608349900 CreatorName Nishijima, Masahiko
	CreatorName Hsieh, Ming Chun
	CreatorName Zheng, Zhang
	CreatorName Suetake, Aiji
	CreatorName Yoshida, Hiroshi
	CreatorName Okumuara, Rieko
	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 CreatorName Chen, Chuantong
	CreatorName Homma, Hidekazu
	CreatorName Kita, Koji
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma CreatorName Suganuma, Katsuaki
Subject	Cu micro-via
	electroless Cu
	STEM
	TOF-SIMS
Description	Nishijima M., Hsieh M.C., Zheng Z., et al. Study of Cu Micro-via by TOF-SIMS and STEM. 2023 International Conference on Electronics Packaging, ICEP 2023 , 151 (2023); https://doi.org/10.23919/ICEP58572.2023.10129689.
Abstract	The micro-via is a sandwiched structure with Cu electrolyte plating/electroless Cu plating/Cu electrolyte plating Pad, and the quality of the electroless Cu layer significantly affects the reliability of micro-via. In this work, we investigated the elemental ingredient of micro-vias which were prepared by a traditional electroless Cu plating method and a newly developed electroless Cu plating method by time of flight secondary ion mass spectrometry (TOF-SIMS) and scanning transmission electron microscopy (STEM). It is found that the concentration of hydrogen, oxygen and several elements exist in the electroless Cu layer prepared by traditional method compared to the new one. These can be a potential risk of nanovoids formation in the electroless Cu layer and decrease the reliability of HDI substrate.
Conference Information	Conference Name 2023 International Conference on Electronics Packaging (ICEP) Conference Sequence 22 Conference Sponsor Japan Institute of Electronics Packaging(JIEP) Conference Date April 19th to April 22nd 2023 Conference Venue Civic Auditorium Sears Home Yume Hall Conference Place Kumamoto Conference Country Japan
Publisher	Institute of Electrical and Electronics Engineers Inc.
Source Title	2023 International Conference on Electronics Packaging
Page	151-152
Date of Issued	2023-05-23
Language	English
Handle URL	https://hdl.handle.net/11094/94634
Relation.isVersionOf	DOI (Publisher Version) https://doi.org/10.23919/ICEP58572.2023.10129689
Relation.isPartOf	ISBN 9798350336726
Access Rights	open access
CopyRight	© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
oaire:version	Accepted Manuscript
Category	会議発表論文 Conference Paper

Resource Type	conference paper
Local Type	Conference Paper
DCMI Type	Text
DCTERMS.bibliographicCitation	2023 International Conference on Electronics Packaging. 2023, p. 151-152
DC.title	Study of Cu Micro-via by TOF-SIMS and STEM
DC.creator	Nishijima, Masahiko
	Hsieh, Ming Chun
	Zheng, Zhang
	Suetake, Aiji
	Yoshida, Hiroshi
	Okumuara, Rieko
	Chen, Chuantong
	Homma, Hidekazu
	Kita, Koji
	Suganuma, Katsuaki
DC.publisher	Institute of Electrical and Electronics Engineers Inc.
DC.language' scheme='DCTERMS.RFC1766	English
DC.type' scheme='DCTERMS.DCMIType	Text
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2023-05-23
DC.identifier	https://doi.org/10.23919/ICEP58572.2023.10129689
DC.subject	Cu micro-via
	electroless Cu
	STEM
	TOF-SIMS
DC.description	Nishijima M., Hsieh M.C., Zheng Z., et al. Study of Cu Micro-via by TOF-SIMS and STEM. 2023 International Conference on Electronics Packaging, ICEP 2023 , 151 (2023); https://doi.org/10.23919/ICEP58572.2023.10129689.
DCTERMS.abstract	The micro-via is a sandwiched structure with Cu electrolyte plating/electroless Cu plating/Cu electrolyte plating Pad, and the quality of the electroless Cu layer significantly affects the reliability of micro-via. In this work, we investigated the elemental ingredient of micro-vias which were prepared by a traditional electroless Cu plating method and a newly developed electroless Cu plating method by time of flight secondary ion mass spectrometry (TOF-SIMS) and scanning transmission electron microscopy (STEM). It is found that the concentration of hydrogen, oxygen and several elements exist in the electroless Cu layer prepared by traditional method compared to the new one. These can be a potential risk of nanovoids formation in the electroless Cu layer and decrease the reliability of HDI substrate.
DC.rights	© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
DC.format	94634
citation_title	Study of Cu Micro-via by TOF-SIMS and STEM
citation_author	Nishijima, Masahiko
	Hsieh, Ming Chun
	Zheng, Zhang
	Suetake, Aiji
	Yoshida, Hiroshi
	Okumuara, Rieko
	Chen, Chuantong
	Homma, Hidekazu
	Kita, Koji
	Suganuma, Katsuaki
citation_publisher	Institute of Electrical and Electronics Engineers Inc.
citation_language	English
citation_date	2023-05-23
citation_journal_title	2023 International Conference on Electronics Packaging
citation_firstpage	151
citation_lastpage	152
citation_doi	https://doi.org/10.23919/ICEP58572.2023.10129689
citation_public_url	https://hdl.handle.net/11094/94634

Study of Cu Micro-via by TOF-SIMS and STEM

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