Ultraflexible Wireless Imager Integrated with Organic Circuits for Broadband Infrared Thermal Analysis

Kawabata, Rei; Li, Kou; Araki, Teppei et al.

Advanced Materials, 2024, 36(15), 2309864

Number of Access:1,8452025-08-16 04:13 Counts

Identifier to cite or link to this item: https://hdl.handle.net/11094/95264

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