Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Liu, Yang; Chen, Chuantong; Wang, Ye; Zhang, Zheng; Liu, Ran; Ueshima, Minoru; Ota, Ichiro; Nishikawa, Hiroshi; Nishijima, Masahiko; Nakayama, Koji S.; Suganuma, Katsuaki

doi:https://doi.org/10.1016/j.compositesb.2024.111519

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Liu, Yang; Chen, Chuantong; Wang, Ye et al.

Composites Part B: Engineering, 2024, 281, 111519

Number of Access:502（2025-06-19 13:51 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/97169

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Title	Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
Creator	NRID 1000080922088 1000080922088 researchmap permalink lyy lyy CreatorName Liu, Yang
	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 CreatorName Chen, Chuantong
	CreatorName Wang, Ye
	CreatorName Zhang, Zheng
	CreatorName Liu, Ran
	CreatorName Ueshima, Minoru
	CreatorName Ota, Ichiro
	NRID 1000090346180 1000090346180 ORCID 0000-0002-4363-9520 0000-0002-4363-9520 researchmap permalink read0191232 read0191232 Scopus Author ID 57219209494 57219209494 CreatorName Nishikawa, Hiroshi
	ORCID 0000-0002-5143-7558 0000-0002-5143-7558 researchmap permalink 7000005445 7000005445 Scopus Author ID 13608349900 13608349900 CreatorName Nishijima, Masahiko
	NRID 1000050312640 1000050312640 ORCID 0000-0002-9165-3810 0000-0002-9165-3810 researchmap permalink kojisnakayama kojisnakayama CreatorName Nakayama, Koji S.
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma CreatorName Suganuma, Katsuaki
Subject	Ag@Si composite sintering
	Buildup stress mitigation
	Closer matched CTE
	Enhanced reliability
	Inhibited degradation
Description	Liu Y., Chen C., Wang Y., et al. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation. Composites Part B: Engineering 281, 111519 (2024); https://doi.org/10.1016/j.compositesb.2024.111519.
Abstract	Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is incorporated into sintered Ag matrix to develop an Ag@Si composite sintering strategy. The Si integration helps reduce cost and alleviate CTE-mismatch of Ag-sintered die attachments. An innovative Ag@Si composite sintering structure is achieved by low-temperature and pressure-less sintering process, where a possibly slight diffusion of native SiO2 on the Si surface toward Ag is indicated by TEM observation, enabling the integration of Ag and Si into one continuous network. Owing to the robust well-bonded composite sintering, the Ag@Si joining strategy provides mechanical/microstructural reliability far beyond the pure Ag sinter joining, demonstrating significant prospects in high-temperature interconnection applications. During the harsh thermal cycling (−50–250 °C), the mitigating effect of the Si addition on CTE mismatch is manifested through the substantial suppression of microstructure deterioration in Ag@Si joint that occurs in pure-Ag-sintered joint, while the shear strength retention rate is doubled. Detailed investigation into the mechanism for elevated performance was conducted by material property and Missies stress analysis. The incorporation of Si helps modify the CTE, elastic properties, and stress distribution of Ag@Si-sintered material, synergistically contributing to the satisfactory joining reliability.
Publisher	Elsevier Ltd
Source Title	Composites Part B: Engineering
Volume (Issue)	281
Page	111519
Date of Issued	2024-07-15
Language	English
Handle URL	https://hdl.handle.net/11094/97169
PISSN	13598368
Relation.isIdenticalTo	DOI (Publisher Version) https://doi.org/10.1016/j.compositesb.2024.111519
Access Rights	open access
CopyRight	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
oaire:version	Version of Record
Category	学術雑誌論文 Journal Article

Resource Type	journal article
Local Type	Journal Article
DCTERMS.bibliographicCitation	Composites Part B: Engineering. 2024, 281, p. 111519
DC.title	Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
DC.creator	Liu, Yang
	Chen, Chuantong
	Wang, Ye
	Zhang, Zheng
	Liu, Ran
	Ueshima, Minoru
	Ota, Ichiro
	Nishikawa, Hiroshi
	Nishijima, Masahiko
	Nakayama, Koji S.
	Suganuma, Katsuaki
DC.publisher	Elsevier Ltd
DC.language' scheme='DCTERMS.RFC1766	English
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2024-07-15
DC.identifier	https://doi.org/10.1016/j.compositesb.2024.111519
DC.subject	Ag@Si composite sintering
	Buildup stress mitigation
	Closer matched CTE
	Enhanced reliability
	Inhibited degradation
DC.description	Liu Y., Chen C., Wang Y., et al. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation. Composites Part B: Engineering 281, 111519 (2024); https://doi.org/10.1016/j.compositesb.2024.111519.
DCTERMS.abstract	Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is incorporated into sintered Ag matrix to develop an Ag@Si composite sintering strategy. The Si integration helps reduce cost and alleviate CTE-mismatch of Ag-sintered die attachments. An innovative Ag@Si composite sintering structure is achieved by low-temperature and pressure-less sintering process, where a possibly slight diffusion of native SiO2 on the Si surface toward Ag is indicated by TEM observation, enabling the integration of Ag and Si into one continuous network. Owing to the robust well-bonded composite sintering, the Ag@Si joining strategy provides mechanical/microstructural reliability far beyond the pure Ag sinter joining, demonstrating significant prospects in high-temperature interconnection applications. During the harsh thermal cycling (−50–250 °C), the mitigating effect of the Si addition on CTE mismatch is manifested through the substantial suppression of microstructure deterioration in Ag@Si joint that occurs in pure-Ag-sintered joint, while the shear strength retention rate is doubled. Detailed investigation into the mechanism for elevated performance was conducted by material property and Missies stress analysis. The incorporation of Si helps modify the CTE, elastic properties, and stress distribution of Ag@Si-sintered material, synergistically contributing to the satisfactory joining reliability.
DC.rights	This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
DC.format	97169
citation_title	Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
citation_author	Liu, Yang
	Chen, Chuantong
	Wang, Ye
	Zhang, Zheng
	Liu, Ran
	Ueshima, Minoru
	Ota, Ichiro
	Nishikawa, Hiroshi
	Nishijima, Masahiko
	Nakayama, Koji S.
	Suganuma, Katsuaki
citation_publisher	Elsevier Ltd
citation_language	English
citation_date	2024-07-15
citation_journal_title	Composites Part B: Engineering
citation_volume	281
citation_firstpage	111519
citation_doi	https://doi.org/10.1016/j.compositesb.2024.111519
citation_public_url	https://hdl.handle.net/11094/97169

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

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