Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition

Wang, Chuncheng; Tatsumi, Hiroaki; Nishikawa, Hiroshi

Journal of Materials Science, 2024, 59(40), 19038-19056

Number of Access:505（2025-08-14 01:39 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/98392

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Title
Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition
Creator
CreatorName
Wang, Chuncheng
NRID
1000000961757 1000000961757
ORCID
0000-0002-0561-3100 0000-0002-0561-3100
researchmap permalink
hiroaki_tatsumi hiroaki_tatsumi
Scopus Author ID
54914528200 54914528200
CreatorName
Tatsumi, Hiroaki
NRID
1000090346180 1000090346180
ORCID
0000-0002-4363-9520 0000-0002-4363-9520
researchmap permalink
read0191232 read0191232
Scopus Author ID
57219209494 57219209494
CreatorName
Nishikawa, Hiroshi
Description
The version of record of this article, first published in Journal of Materials Science, is available online at Publisher’s website: https://doi.org/10.1007/s10853-024-10250-1.
Abstract
In wide-bandgap semiconductor power device packaging, die bonding refers to attaching the die to substrate. Thereby, the process temperature of Ag sintering for the die bonding should be low to prevent damage to fragile dies. Herein, an organic-free strategy using Ag nanostructures derived from the thermal decomposition of metal–organic decomposition (MOD) was proposed to achieve low-temperature bonding. Significant effects on bonding performance were determined by the thermal decomposition temperature, which in turn determined the organic content and sintering degree of Ag nanostructures. At a low thermal decomposition temperature of 160 °C, incomplete decomposition resulted in high organic content in the Ag nanostructures, causing large pores inside the Ag joints owing to the generation of gaseous products. Owing to the Ag particles with naked surfaces and wide size distribution, the Ag nanostructure obtained at 180 °C showed an excellent bonding performance, resulting in a high shear strength of 31.1 MPa at a low bonding temperature of 160 °C. As the thermal decomposition temperature was 200 °C, sintering among Ag particles increased the particle size, resulting in a reduction of surface energy and driving force for sintering. We think that uncovering this underlying mechanism responsible for the bonding performance will promote the application of Ag MOD in the die bonding of WBG power devices.
Publisher
Springer
Source Title
Journal of Materials Science
Volume (Issue)
59(40)
Page
19038-19056
Date of Issued
2024-10-15
Language
English
Handle URL
https://hdl.handle.net/11094/98392
PISSN
00222461
eISSN
15734803
Relation.isIdenticalTo
DOI (Publisher Version)
https://doi.org/10.1007/s10853-024-10250-1
Access Rights
open access
CopyRight
This article is licensed under a Creative Commons Attribution 4.0 International License.
oaire:version
Version of Record
Category
学術雑誌論文 Journal Article