Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate

Zhang, Zheng; Hsieh, Ming Chun; Nishijima, Masahiko; Suetake, Aiji; Yoshida, Hiroshi; Okumuara, Rieko; Chen, Chuantong; Seto, Hiroki; Hashizume, Kei; Kitahara, Yuhei; Nagamura, Haruki; Suganuma, Katsuaki

doi:https://doi.org/10.1016/j.apsusc.2024.161128

Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate

Zhang, Zheng; Hsieh, Ming Chun; Nishijima, Masahiko et al.

Applied Surface Science, 2024, 678, 161128

Number of Access:960（2025-08-24 13:59 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/98430

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Title	Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
Creator	ORCID 0000-0002-4201-3120 0000-0002-4201-3120 researchmap permalink 061516 061516 Scopus Author ID 57202582942 57202582942 NRID 1000010889314 1000010889314 CreatorName Zhang, Zheng
	CreatorName Hsieh, Ming Chun
	ORCID 0000-0002-5143-7558 0000-0002-5143-7558 researchmap permalink 7000005445 7000005445 Scopus Author ID 13608349900 13608349900 CreatorName Nishijima, Masahiko
	CreatorName Suetake, Aiji
	NRID 1000030133929 1000030133929 CreatorName Yoshida, Hiroshi
	CreatorName Okumuara, Rieko
	NRID 1000050791703 1000050791703 ORCID 0000-0002-2365-4387 0000-0002-2365-4387 researchmap permalink chenchuantong chenchuantong Scopus Author ID 57189686286 57189686286 CreatorName Chen, Chuantong
	CreatorName Seto, Hiroki
	CreatorName Hashizume, Kei
	CreatorName Kitahara, Yuhei
	CreatorName Nagamura, Haruki
	NRID 1000010154444 1000010154444 researchmap permalink ksuganuma ksuganuma CreatorName Suganuma, Katsuaki
Subject	Electroless Cu deposition
	Hydrogen bubbles
	Microstructure
	Nanovoids
	TEM observations
Description	Zhang Z., Hsieh M.C., Nishijima M., et al. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate. Applied Surface Science 678, 161128 (2024); https://doi.org/10.1016/j.apsusc.2024.161128.
Abstract	In this work, we investigated the microstructure evolution of electroless copper (Cu) deposition under different nickel (Ni) additions and reaction temperatures. It was found that the grain structure of electroless Cu is significantly influenced by the addition of Ni due to its inhibitory effect on Cu self-diffusion, while bath temperature had no impact on the electroless Cu grain growth. Additionally. nanovoids were observed in the electroless layer, primarily at the interface between the Cu trace and electroless layer, which is caused by the attachment of hydrogen bubbles during the electroless Cu reaction. These nanovoids do not affect the epitaxial grain growth in the microvia structure as observed through transmission electron microscopy (TEM). The nanovoids in the electroless Cu under different deposition conditions were also investigated through TEM images with the assistance of ImageJ. We found that the dimension of nanovoids initially increases with the reaction rate, as a result of the higher deposition rate introducing large hydrogen bubbles. However, as the reaction rate further increases, the size of the nanovoids stabilizes because larger hydrogen bubbles more easily escape the surface. This work may offer insights into potential approaches to enhance the quality of electroless Cu deposition for microvia preparation.
Publisher	Elsevier B.V.
Source Title	Applied Surface Science
Volume (Issue)	678
Page	161128
Date of Issued	2024-12-30
Language	English
Handle URL	https://hdl.handle.net/11094/98430
PISSN	01694332
Relation.isIdenticalTo	DOI (Publisher Version) https://doi.org/10.1016/j.apsusc.2024.161128
Access Rights	open access
CopyRight	This article is licensed under a Creative Commons Attribution 4.0 International License.
oaire:version	Version of Record
Category	学術雑誌論文 Journal Article

Resource Type	journal article
Local Type	Journal Article
DCTERMS.bibliographicCitation	Applied Surface Science. 2024, 678, p. 161128
DC.title	Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
DC.creator	Zhang, Zheng
	Hsieh, Ming Chun
	Nishijima, Masahiko
	Suetake, Aiji
	Yoshida, Hiroshi
	Okumuara, Rieko
	Chen, Chuantong
	Seto, Hiroki
	Hashizume, Kei
	Kitahara, Yuhei
	Nagamura, Haruki
	Suganuma, Katsuaki
DC.publisher	Elsevier B.V.
DC.language' scheme='DCTERMS.RFC1766	English
DCTERMS.issued' scheme='DCTERMS.W3CDTF	2024-12-30
DC.identifier	https://doi.org/10.1016/j.apsusc.2024.161128
DC.subject	Electroless Cu deposition
	Hydrogen bubbles
	Microstructure
	Nanovoids
	TEM observations
DC.description	Zhang Z., Hsieh M.C., Nishijima M., et al. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate. Applied Surface Science 678, 161128 (2024); https://doi.org/10.1016/j.apsusc.2024.161128.
DCTERMS.abstract	In this work, we investigated the microstructure evolution of electroless copper (Cu) deposition under different nickel (Ni) additions and reaction temperatures. It was found that the grain structure of electroless Cu is significantly influenced by the addition of Ni due to its inhibitory effect on Cu self-diffusion, while bath temperature had no impact on the electroless Cu grain growth. Additionally. nanovoids were observed in the electroless layer, primarily at the interface between the Cu trace and electroless layer, which is caused by the attachment of hydrogen bubbles during the electroless Cu reaction. These nanovoids do not affect the epitaxial grain growth in the microvia structure as observed through transmission electron microscopy (TEM). The nanovoids in the electroless Cu under different deposition conditions were also investigated through TEM images with the assistance of ImageJ. We found that the dimension of nanovoids initially increases with the reaction rate, as a result of the higher deposition rate introducing large hydrogen bubbles. However, as the reaction rate further increases, the size of the nanovoids stabilizes because larger hydrogen bubbles more easily escape the surface. This work may offer insights into potential approaches to enhance the quality of electroless Cu deposition for microvia preparation.
DC.rights	This article is licensed under a Creative Commons Attribution 4.0 International License.
DC.format	98430
citation_title	Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
citation_author	Zhang, Zheng
	Hsieh, Ming Chun
	Nishijima, Masahiko
	Suetake, Aiji
	Yoshida, Hiroshi
	Okumuara, Rieko
	Chen, Chuantong
	Seto, Hiroki
	Hashizume, Kei
	Kitahara, Yuhei
	Nagamura, Haruki
	Suganuma, Katsuaki
citation_publisher	Elsevier B.V.
citation_language	English
citation_date	2024-12-30
citation_journal_title	Applied Surface Science
citation_volume	678
citation_firstpage	161128
citation_doi	https://doi.org/10.1016/j.apsusc.2024.161128
citation_public_url	https://hdl.handle.net/11094/98430

Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate

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