Application of a thermal circuit model for the prediction of interfacial thermal resistance between water and a nanostructure surface using molecular dynamics simulations

Jiang, Zhiwen; Shibahara, Masahiko

International Journal of Thermal Sciences, 2025, 208, 109441

Number of Access:2962025-08-28 20:32 Counts

Identifier to cite or link to this item: https://hdl.handle.net/11094/98473

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