Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique

Mori, Naoki; Hakkaku, Toru; Hayashi, Takahiro

Measurement Science and Technology, 2024, 36, 015605

Number of Access:445（2025-10-05 08:02 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/98532

Link to primary information 

File Format Terms of use Size Views Date.Available Description information
MeasSciTechnol_36_1_015605 pdf None 11.1 MB   2025.11.22  
Creative Commons : Attribution - NonCommercial - NoDerivatives

Item Information

Output File Export EndNote Basic Export Mendeley

Title
Curing monitoring of adhesive layers between metal adherends by ultrasonic resonance technique
Creator
NRID
1000000802092 1000000802092
ORCID
0000-0002-0707-3443 0000-0002-0707-3443
researchmap permalink
7000020478 7000020478
Scopus Author ID
55614094500 55614094500
CreatorName
Mori, Naoki
CreatorName
Hakkaku, Toru
NRID
1000030324479 1000030324479
ORCID
0000-0001-6064-4658 0000-0001-6064-4658
researchmap permalink
takahiro_hayashi takahiro_hayashi
Scopus Author ID
37064150200 37064150200
CreatorName
Hayashi, Takahiro
Subject
Adhesive curing
Ultrasonic wave
Layer resonance
Spectral analysis
Viscoelasticity
Description
This is the Accepted Manuscript version of an article accepted for publication in Measurement Science and Technology. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6501/ad8f51.
Abstract
Layer resonance induced by ultrasonic wave incidence is applied to monitor the viscoelastic properties of a curing adhesive layer between metal plates. A theoretical analysis shows that when the adhesive layer is modeled as a linear viscoelastic material, the ultrasonic reflection spectrum takes local minima at the layer resonance frequencies depending on the wave velocity of the adhesive. In contrast, the local minima of the reflection spectrum can be expressed as a function of the loss factor of the adhesive. Based on these results, a characterization technique for the wave velocity and the loss factor of a curing adhesive layer is proposed. This technique enables the evaluation of viscoelastic properties even if the reflected waves from both faces of a bond layer cannot be separated. The proposed method is used to investigate the curing behavior of bi-component epoxy adhesives. It is shown that the bonding condition affects the variation of the wave velocity and loss factor. The estimated wave velocity increases as the curing proceeds, whereas the loss factor sometimes takes a local maximum depending on the bonding condition and the frequency range. When the mixing ratio of the main and curing agents is imbalanced, the variation of the wave velocity becomes gradual. Furthermore, the increase in the curing temperature leads to fast changes in the wave velocity and loss factor. The proposed technique has the potential to provide insights into the curing behavior of the adhesive layer by incorporating it into other measurement methods and theories.
Publisher
IOP Publishing
Source Title
Measurement Science and Technology
Volume (Issue)
36
Page
015605
Date of Issued
2024-11-22
Language
English
Handle URL
https://hdl.handle.net/11094/98532
PISSN
09570233
eISSN
13616501
Relation.isVersionOf
DOI (Publisher Version)
https://doi.org/10.1088/1361-6501/ad8f51
Access Rights
embargoed access
CopyRight
This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
The full-text file will be made open to the public on 22 November 2025 in accordance with the publisher's policy.
oaire:version
Accepted Manuscript
Category
学術雑誌論文 Journal Article