Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Huo, Fupeng; Chen, Chuantong; Zhang, Zheng et al.

Journal of Materials Research and Technology, 2024, 31, 3591-3603

Number of Access:811（2025-08-24 13:59 Counts）

Identifier to cite or link to this item: https://hdl.handle.net/11094/98541

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Title
Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
Creator
CreatorName
Huo, Fupeng
NRID
1000050791703 1000050791703
ORCID
0000-0002-2365-4387 0000-0002-2365-4387
researchmap permalink
chenchuantong chenchuantong
Scopus Author ID
57189686286 57189686286
CreatorName
Chen, Chuantong
NRID
1000010889314 1000010889314
ORCID
0000-0002-4201-3120 0000-0002-4201-3120
researchmap permalink
061516 061516
Scopus Author ID
57202582942 57202582942
CreatorName
Zhang, Zheng
CreatorName
Zhang, Yicheng
CreatorName
Suetake, Aiji
CreatorName
Takeshita, Kazutaka
CreatorName
Yamaguchi, Yoshiji
CreatorName
Momose, Yashima
CreatorName
Zhang, Keke
NRID
1000010154444 1000010154444
researchmap permalink
ksuganuma ksuganuma
CreatorName
Suganuma, Katsuaki
Subject
Graphene
Mechanical properties
Microstructure
SnAgCu
Surface metallization
Wettability
Description
Huo F., Chen C., Zhang Z., et al. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties. Journal of Materials Research and Technology 31, 3591 (2024); https://doi.org/10.1016/j.jmrt.2024.07.071.
Abstract
Based on the principles of micro-alloying and composite, the graphene reinforced Sn2.5Ag0.7Cu0.1Ce composite solder was designed. Ni nanoparticle-modified reduced graphene oxide (Ni-rGO) was prepared by thermal decomposition method, and the powder-melting method was proposed for the first time to prepare Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder. The microstructure, wettability, electrical resistivity, and mechanical properties of the composite solder were systematically studied. Results indicated that the Ni nanoparticles uniformly adhered to the rGO with a size of 26.3 nm. The effective incorporation of Ni-rGO into the solder matrix was achieved. The result broke the technical difficulty that graphene cannot be effectively added to low melting point metals. With the addition of Ni-rGO, the grain size gradually decreased, and the eutectic structures increased. Deep etching results revealed that columnar β-Sn was stacked from layered β-Sn, the addition of 0.05 wt% Ni-rGO led to an increase in sheet-like Ag3Sn within the eutectics. Additionally, Ni-rGO was found at the grain boundaries of composite solder, serving as nucleation sites for Ag3Sn and Cu6Sn5. At an addition of 0.05 wt%, the tensile strength reaches a maximum of 58.1 MPa, with elongation of 33.8%, surpassing the strength of commercial Sn3.0Ag0.5Cu solder. Therefore, the high-strength and tough composite solder was obtained. This study offered a new approach for the development of low-melting-point composite materials.
Publisher
Elsevier Editora Ltda
Source Title
Journal of Materials Research and Technology
Volume (Issue)
31
Page
3591-3603
Date of Issued
2024-07-01
Language
English
Handle URL
https://hdl.handle.net/11094/98541
PISSN
22387854
Relation.isIdenticalTo
DOI (Publisher Version)
https://doi.org/10.1016/j.jmrt.2024.07.071
Access Rights
open access
CopyRight
This article is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
oaire:version
Version of Record
Category
学術雑誌論文 Journal Article