Identifier to cite or link to this item: https://doi.org/10.18910/77495

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File	Format	Terms of use	Size	Views	Date.Available	Description	information
31485_Abstract	pdf	None	136 KB	408	2020.11.19
31485_Dissertation	pdf	None	25.3 MB	962	2020.11.19

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Title	Studies on Thermal Design Evaluation Method of SiC Power Module
	SiCパワーモジュールの熱設計評価法に関する研究
	SiCパワーモジュールノネツセッケイヒョウカホウニカンスルケンキュウ
Creator	NRID 1000020914138 1000020914138 ORCID 0000-0001-6058-2047 0000-0001-6058-2047 researchmap permalink sfukunaga sfukunaga Scopus Author ID 57192577087 57192577087 CreatorName 福永, 崇平 ; フクナガ, シュウヘイ
Degree Name	博士（工学）
Date of Granted	2020-09-25
Grantor	Osaka University
Faculty	工学
Specialty	電気電子情報工学
Grant ID	甲第21109号
Description Number	31485
Language	English
Handle URL	https://hdl.handle.net/11094/77495
DOI	https://doi.org/10.18910/77495
Access Rights	open access
oaire:version	Version of Record
Category	Doctoral Thesis with Full Text / Graduate School of Engineering / 2020
	Doctoral Thesis / Graduate School of Engineering / 2020

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